Inventor
ISHIZUKI YOSHIKATSU
JP25 patents
⚠️ This page may combine multiple inventors who share the name “ISHIZUKI YOSHIKATSU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
18 patentsUS7355290B2Apr 8, 2008
Interposer and method for fabricating the same
FUJITSU LTD20 citations92
US5386430AJan 31, 1995
Excimer laser processing method and apparatus
FUJITSU LTD46 citations89
US7614142B2Nov 10, 2009
Method for fabricating an interposer
FUJITSU LTD11 citations84
US7514295B2Apr 7, 2009
Method for processing a base that includes connecting a first base to a second base with an insulating film
FUJITSU LTD12 citations84
US7405366B2Jul 29, 2008
Interposer and electronic device fabrication method
FUJITSU LTD12 citations84
US6943447B2Sep 13, 2005
Thin film multi-layer wiring substrate having a coaxial wiring structure in at least one layer
FUJITSU LTD6 citations74
US5429709AJul 4, 1995
Method of manufacturing polyimide multilayer printed wiring boards
FUJITSU LTD7 citations73
US9837208B2Dec 5, 2017
Inductor apparatus and inductor apparatus manufacturing method
FUJITSU LTD5 citations72
US9312151B2Apr 12, 2016
Method of manufacturing semiconductor device and method of manufacturing electronic device including an adhesive layer on a support member
FUJITSU LTD2 citations63
US9136172B2Sep 15, 2015
Method of manufacturing semiconductor device and method of manufacturing electronic assembly
FUJITSU LTD2 citations63
US7937830B2May 10, 2011
Interposer and electronic device fabrication method
FUJITSU LTD5 citations63
US7816180B2Oct 19, 2010
Method for processing a base that includes connecting a first base to a second base
FUJITSU LTD4 citations63
US7811835B2Oct 12, 2010
Method for processing a base that includes connecting a first base to a second base with an insulating film
FUJITSU LTD2 citations63
US7852439B2Dec 14, 2010
Multi-layer display element and manufacturing method for the same
FUJITSU LTD2 citations61
US9888575B2Feb 6, 2018
Electronic device and method for manufacturing electronic device
FUJITSU LTD0 citations52
US9214361B2Dec 15, 2015
Semiconductor device manufacturing method and electronic device manufacturing method
FUJITSU LTD1 citations52
US10483195B2Nov 19, 2019
Resin board, method of manufacturing resin board, circuit board, and method of manufacturing circuit board
FUJITSU LTD0 citations41
US10057995B2Aug 21, 2018
Electronic device
FUJITSU LTD0 citations41
NIPPON ZEON CO
4 patentsUS6001488ADec 14, 1999
Composition of epoxy group-containing cycloolefin resin
NIPPON ZEON CO58 citations95
US5895800AApr 20, 1999
Composition of epoxy group-containing cycloolefin resin
NIPPON ZEON CO21 citations91
US5777068AJul 7, 1998
Photosensitive polyimide resin composition
NIPPON ZEON CO11 citations73
US5886136AMar 23, 1999
Pattern forming process
NIPPON ZEON CO12 citations71
MIZUKOSHI MASATAKA
2 patentsUS8704106B2Apr 22, 2014
Ferroelectric component and manufacturing the same
MIZUKOSHI MASATAKA8 citations82
US8962470B2Feb 24, 2015
Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus
MIZUKOSHI MASATAKA1 citations50