Inventor

HA JONG WOO

KR56 patents

⚠️ This page may combine multiple inventors who share the name “HA JONG WOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HA JONG WOO

STATS CHIPPAC LTD

Integrated circuit package-in-package system

Stacked integrated circuit package-in-package system

Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof

Stacked integrated circuit package system

Mountable integrated circuit package-in-package system with adhesive spacing structures

Integrated circuit package-in-package system with carrier interposer

Integrated circuit package system

Stacked integrated circuit package-in-package system

Stacked integrated circuit package-in-package system

Integrated circuit package on package system

Integrated circuit packaging system with inward and outward interconnects and method of manufacture thereof

Integrated circuit package system employing an offset stacked configuration

Integrated circuit package system including stacked die

Integrated circuit package system including stacked die

Stacked integrated circuit package-in-package system

Integrated circuit packaging system with carrier and method of manufacture thereof

Integrated circuit package-in-package system

Stacked integrated circuit package-in-package system

Stacked die package system

Stacked die package system

Integrated circuit package system including wafer level spacer

Integrated circuit package system with net spacer

Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof

Integrated circuit packaging system with lead frame and method of manufacture thereof

Integrated circuit packaging system with base structure device

Integrated circuit package-in-package system with side-by-side and offset stacking

Integrated circuit package system with stacking module

Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereof

Integrated circuit package-in-package system and method for making thereof

Ball grid array package stacking system

HA JONG-WOO

Stacked integrated circuit package system with face to face stack configuration

Planar encapsulation and mold cavity package in package system

Integrated circuit packaging system with stacked configuration and method of manufacture thereof

Stacked integrated circuit package system

Integrated circuit package system having cavity

Integrated circuit packaging system with lead frame and method of manufacture thereof

Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires

Method for manufacturing ball grid array package stacking system

LEE SANG-HO

Integrated circuit package system with waferscale spacer

Integrated circuit package system with waferscale spacer

SONG SUNGMIN

Integrated circuit package system with multi-chip module

CARSON FLYNN

Stacked integrated circuit package system and method for manufacturing thereof

LEE SEONGMIN

Integrated circuit package stacking system with redistribution and method of manufacture thereof

SHIM IL KWON

Integrated circuit packaging system with embedded circuitry and post

SHIN HANGIL

Integrated circuit packaging system with package-on-package and method of manufacture thereof

PAGAILA REZA ARGENTY

Integrated circuit packaging system with mountable inward and outward interconnects and method of manufacture thereof

ROOTS CO LTD

Manufacturing method of ceramic chips

KIM OHSUG

Stacked integrated circuit package-in-package system and method of manufacture thereof

CHOI DAESIK

Integrated circuit packaging system with step mold and method of manufacture thereof

PARK SOO-SAN

Integrated circuit package-in-package system with side-by-side and offset stacking and method for manufacturing thereof