Inventor

YAP WENG F

US27 patents

⚠️ This page may combine multiple inventors who share the name “YAP WENG F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YAP WENG F

YAP WENG F

Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof

System-in-packages having vertically-interconnected leaded components and methods for the fabrication thereof

Microelectronic packages having texturized solder pads and methods for the fabrication thereof

Methods for the production of microelectronic packages having radiofrequency stand-off layers

Optically-masked microelectronic packages and methods for the fabrication thereof

Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof

Microelectronic packages containing opposing devices and methods for the fabrication thereof

Wafer level packages having non-wettable solder collars and methods for the fabrication thereof

Packaged semiconductor device

Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof

Methods relating to intermetallic testing of bond integrity between bond pads and copper-containing bond wires

FREESCALE SEMICONDUCTOR INC

Wafer level packaging method

Integrated electronic package and stacked assembly thereof

Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof

Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereof

Stacked microelectronic package assemblies and methods for the fabrication thereof

Integrated electronic package and method of fabrication

Radio frequency and electromagnetic interference shielding in wafer level packaging using redistribution layers

System-in-packages containing preassembled surface mount device modules and methods for the production thereof

Microelectronic packages having radio frequency stand-off layers

Semiconductor package with thermal via and method for fabrication thereof

VINCENT MICHAEL B

Devices and stacked microelectronic packages with package surface conductors and adjacent trenches and methods of their fabrication

Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers

GONG ZHIWEI

Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereof

PABST EDUARD J

Shielded device packages having antennas and related fabrication methods

WRIGHT JASON R

Devices and stacked microelectronic packages with in-trench package surface conductors and methods of their fabrication

MAGNUS ALAN J

Microelectronic packages having layered interconnect structures and methods for the manufacture thereof