P

Inventor

LO TING-YA

TW28 patents

Patents

28 patents
US11538749B2Dec 27, 2022

Interconnect structure

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations85
US12176246B2Dec 24, 2024

Dielectric capping structure overlying a conductive structure to increase stability

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US12068193B2Aug 20, 2024

Semiconductor device structure with interconnect structure having air gap

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11810815B2Nov 7, 2023

Dielectric capping structure overlying a conductive structure to increase stability

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11355430B2Jun 7, 2022

Capping layer overlying dielectric structure to increase reliability

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11322395B2May 3, 2022

Dielectric capping structure overlying a conductive structure to increase stability

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11854963B2Dec 26, 2023

Semiconductor interconnection structure and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12230537B2Feb 18, 2025

Semiconductor device structure having air gap and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12564045B2Feb 24, 2026

Semiconductor device structure with interconnect structure having air gap

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12463134B2Nov 4, 2025

Semiconductor interconnection structure and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12431386B2Sep 30, 2025

Semiconductor device having metallization layer with low capacitance and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12412780B2Sep 9, 2025

Semiconductor device structure and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12381113B2Aug 5, 2025

Semiconductor device structure having air gap and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12165945B2Dec 10, 2024

Thermal interconnect structure for thermal management of electrical interconnect structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12094764B2Sep 17, 2024

Interconnect structure and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12062572B2Aug 13, 2024

Semiconductor device having metallization layer with low capacitance and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12033889B2Jul 9, 2024

Semiconductor device structure and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12027606B2Jul 2, 2024

Semiconductor devices with air gate spacer and air gate cap

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12002749B2Jun 4, 2024

Barrier and air-gap scheme for high performance interconnects

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11990400B2May 21, 2024

Capping layer overlying dielectric structure to increase reliability

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11848198B2Dec 19, 2023

Method for manufacturing semiconductor device having low-k carbon-containing dielectric layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11658092B2May 23, 2023

Thermal interconnect structure for thermal management of electrical interconnect structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11557511B2Jan 17, 2023

Semiconductor device structure and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11302798B2Apr 12, 2022

Semiconductor devices with air gate spacer and air gate cap

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12538773B2Jan 27, 2026

Semiconductor structure having self-aligned conductive structure and method for forming the semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11923243B2Mar 5, 2024

Semiconductor structure having air gaps and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12482703B2Nov 25, 2025

Semiconductor device having thermally conductive air gap structure and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12068248B2Aug 20, 2024

Semiconductor interconnection structure and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51