Inventor

TENG CHI-LIN

TW48 patents

⚠️ This page may combine multiple inventors who share the name “TENG CHI-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TENG CHI-LIN

TAIWAN SEMICONDUCTOR MFG CO LTD

Interconnect structure

Semiconductor device and manufacturing method thereof

Self-aligned interconnection structure and method

Semiconductor structure and method making the same

Dielectric capping structure overlying a conductive structure to increase stability

Semiconductor device structure with interconnect structure having air gap

Dielectric capping structure overlying a conductive structure to increase stability

Capping layer overlying dielectric structure to increase reliability

Dielectric capping structure overlying a conductive structure to increase stability

Interconnect structure including a continuous conductive body

Semiconductor interconnection structure and methods of forming the same

Semiconductor device structure having air gap and methods of forming the same

Semiconductor structure and method making the same

Semiconductor device structure with interconnect structure having air gap

Semiconductor interconnection structure and methods of forming the same

Semiconductor device having metallization layer with low capacitance and method for manufacturing the same

Semiconductor device structure and methods of forming the same

Semiconductor device structure having air gap and methods of forming the same

Metal oxide composite as etch stop layer

Thermal interconnect structure for thermal management of electrical interconnect structure

Interconnect structure and methods of forming the same

Semiconductor device having metallization layer with low capacitance and method for manufacturing the same

Semiconductor device structure and methods of forming the same

Semiconductor devices with air gate spacer and air gate cap

Barrier and air-gap scheme for high performance interconnects

Capping layer overlying dielectric structure to increase reliability

Semiconductor structure and method making the same

Thermal interconnect structure for thermal management of electrical interconnect structure

Semiconductor device structure and methods of forming the same

Semiconductor device and manufacturing method thereof

Semiconductor structure and method making the same

Metal oxide composite as etch stop layer

Semiconductor devices with air gate spacer and air gate cap

Forming interlayer dielectric material by spin-on metal oxide deposition

Semiconductor structure having self-aligned conductive structure and method for forming the semiconductor structure

Semiconductor structure having air gaps and method for manufacturing the same

Semiconductor device and manufacturing method thereof

Semiconductor structure and method making the same

Forming interlayer dielectric material by spin-on metal oxide deposition

Semiconductor device structure

Protecting layer in a semiconductor structure

Semiconductor device structure and method for forming the same

Semiconductor device having thermally conductive air gap structure and method for manufacturing the same

Semiconductor interconnection structure and methods of forming the same

TAIWAN SEMICONDUCTOR MFG

Protecting layer in a semiconductor structure

Semiconductor devices and methods of forming same

LEE MING HAN

Copper etch scheme for copper interconnect structure

(unassigned)

Dyeing machine with reversible dye spouter