Inventor

LAI KWAN-YU

US20 patents

⚠️ This page may combine multiple inventors who share the name “LAI KWAN-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAI KWAN-YU

APPLE INC

Independent 3D stacking

System in package fan out stacking architecture and process flow

Dual molded stack TSV package

Photonics assembly with a photonics die stack

Integrated magnetic passive devices using magnetic film

Wafer reconstitution and die-stitching

Wafer reconstitution and die-stitching

3D fanout stacking

Carrier ultra thin substrate

Finger biometric sensor assembly including direct bonding interface and related methods

Wafer reconstitution and die-stitching

QUALCOMM INC

Semiconductor device with via bar

Electro-optical transceiver device to enable chip-to-chip interconnection

High quality factor capacitors and methods for fabricating high quality factor capacitors

High quality factor capacitors and methods for fabricating high quality factor capacitors

Embedded thin film magnetic carrier for integrated voltage regulator

Integrated interposer with embedded active devices

QUALCOMM MEMS TECHNOLOGIES INC

Incorporation of passives and fine pitch through via for package on package

Metal-insulator-metal capacitors on glass substrates

Integration of a coil and a discontinuous magnetic core