Inventor
YANG KUANG-WEI
TW13 patents
Patents
13 patentsUS11538749B2Dec 27, 2022
Interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations85
US12132000B2Oct 29, 2024
Semiconductor device structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11854963B2Dec 26, 2023
Semiconductor interconnection structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12463134B2Nov 4, 2025
Semiconductor interconnection structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12431386B2Sep 30, 2025
Semiconductor device having metallization layer with low capacitance and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12094764B2Sep 17, 2024
Interconnect structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12074060B2Aug 27, 2024
Semiconductor device structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12062572B2Aug 13, 2024
Semiconductor device having metallization layer with low capacitance and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12484310B2Nov 25, 2025
Semiconductor device structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12205946B2Jan 21, 2025
Semiconductor device structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11923357B2Mar 5, 2024
Semiconductor device structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12412804B2Sep 9, 2025
Semiconductor structure with improved heat dissipation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12482703B2Nov 25, 2025
Semiconductor device having thermally conductive air gap structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51