Inventor

CHANG HSIAO-KANG

TW29 patents

⚠️ This page may combine multiple inventors who share the name “CHANG HSIAO-KANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG HSIAO-KANG

TAIWAN SEMICONDUCTOR MFG CO LTD

Interconnect structure

Semiconductor device structure with interconnect structure having air gap

Semiconductor interconnection structure and methods of forming the same

Semiconductor device structure with interconnect structure having air gap

Semiconductor interconnection structure and methods of forming the same

Semiconductor device having metallization layer with low capacitance and method for manufacturing the same

Semiconductor structure with air gap and method for manufacturing the same

Method for manufacturing semiconductor structure with material in monocrystalline phase

Semiconductor interconnection structures and methods of forming the same

Thermal interconnect structure for thermal management of electrical interconnect structure

Interconnect structure and methods of forming the same

Semiconductor structure having dielectric-on-dielectric structure and method for forming the semiconductor structure

Interconnect structure with low capacitance and high thermal conductivity

Heat dispersion layers for double sided interconnect

Semiconductor device having metallization layer with low capacitance and method for manufacturing the same

Barrier and air-gap scheme for high performance interconnects

Method for manufacturing semiconductor device having low-k carbon-containing dielectric layer

Thermal interconnect structure for thermal management of electrical interconnect structure

Heat dispersion layers for double sided interconnect

Semiconductor structure with improved heat dissipation

Semiconductor structure having self-aligned conductive structure and method for forming the semiconductor structure

Semiconductor device package including a thermal conductive layer and methods of forming the same

Semiconductor structure having air gaps and method for manufacturing the same

Semiconductor device having thermally conductive air gap structure and method for manufacturing the same

Semiconductor interconnection structures and methods of forming the same

Semiconductor interconnection structures and methods of forming the same

Semiconductor interconnection structures comprising a resistor device and methods of forming the same

INTEL CORP

Interconnect structure comprising fine pitch backside metal redistribution lines combined with vias

ZHOU CHONGWU

Transparent electronics based on transfer printed carbon nanotubes on rigid and flexible substrates