Inventor

HSIAO CHEN-HSU

TW2 patents

Patents

2 patents

US6699731B2Mar 2, 2004

Substrate of semiconductor package

SILICONWARE PRECISION INDUSTRIES CO LTD32 citations90

US6483039B2Nov 19, 2002

Substrate of semiconductor package

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49