Inventor

HOU HAO-CHENG

TW36 patents

⚠️ This page may combine multiple inventors who share the name “HOU HAO-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HOU HAO-CHENG

TAIWAN SEMICONDUCTOR MFG CO LTD

Redistribution structures in semiconductor packages and methods of forming same

Substrate design for semiconductor packages and method of forming same

Package structures and methods of forming the same

Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof

Package structure comprising buffer layer for reducing thermal stress and method of forming the same

Package structure comprising buffer layer for reducing thermal stress and method of forming the same

Semiconductor package and manufacturing method thereof

Semiconductor package and semiconductor device

Package structure

Integrated fan-out package and method of fabricating the same

Integrated fan-out package and method of fabricating the same

Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereof

Package structures and methods of forming the same

Connector formation methods and packaged semiconductor devices

Package structure comprising buffer layer for reducing thermal stress and method of forming the same

Semiconductor package and methods of fabricating a semiconductor package

Probe card substrate, substrate structure and method of fabricating the same

Semiconductor package having molded die and semiconductor die and manufacturing method thereof

Package structure and method of fabricating the same

Packaging substrate including an underfill injection opening and methods of forming the same

Semiconductor package

Semiconductor packages and methods of forming same

Connector formation methods and packaged semiconductor devices

Semiconductor structure and method of forming the same

Semiconductor packages and method of manufacturing the same

Laminated structure with pads and manufacturing method thereof

Package structure and forming method thereof

Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices

Package-on-package structure and methods for forming the same

Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices

Connector formation methods and packaged semiconductor devices

Device with optimized thermal characteristics

Three-dimensional semiconductor device and method

TAIWAN SEMICONDUCTOR MFG

Package-on-package structure and methods for forming the same

NAT UNIV TSING HUA

Perpendicular magnetic recording medium

LAI CHIH-HUANG

Magnetic recording media and method for making the same