Inventor

LIN HUNG-JEN

TW35 patents

⚠️ This page may combine multiple inventors who share the name “LIN HUNG-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN HUNG-JEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Redistribution structures in semiconductor packages and methods of forming same

Substrate design for semiconductor packages and method of forming same

Package structures and methods of forming the same

Package assembly

Post-passivation interconnect structure and method of forming the same

Integrated fan-out package and method of fabricating the same

Formation of connectors without UBM

Mechanisms for forming hybrid bonding structures with elongated bumps

Package structures and methods of forming the same

Connector formation methods and packaged semiconductor devices

Method of forming package assembly

Semiconductor packages and methods of forming same

Connector formation methods and packaged semiconductor devices

Semiconductor packages and method of manufacturing the same

Mechanisms for forming hybrid bonding structures with elongated bumps

Post-passivation interconnect structure and method of forming the same

Post-passivation interconnect structure and method of forming the same

Package assembly

Mechanisms for forming hybrid bonding structures with elongated bumps

Connector formation methods and packaged semiconductor devices

TAIWAN SEMICONDUCTOR MFG

Methods and apparatus for wafer level packaging

Stable plating performance in copper electrochemical plating

Methods and apparatus for wafer level packaging

Method for fabricating poly patterns

Low temperature method for metal deposition

AVISION INC

Method of searching an image file in a computer system, related image file searching device, and related computer system

System and method using matrix barcode information to process documents

System and method using matrix barcode information to perform point-to-point information exchange

ADVANCED MICRO DEVICES INC

Apparatus and methods for determining floating body effects in SOI devices

Apparatus and methods for characterizing floating body effects in SOI devices

LIN HUNG-JEN

Package assembly and method of forming the same

WANG TSUNG-DING

Formation of connectors without UBM

WANG TSUNG DING

Semiconductor device packages and methods

SPANSION LLC

High reliable and low power static random access memory

HUANG HAN I

Multi-segment rotation robotic arm