Inventor
HAN CHIH-KANG
TW17 patents
⚠️ This page may combine multiple inventors who share the name “HAN CHIH-KANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
13 patentsUS9922896B1Mar 20, 2018
Info structure with copper pillar having reversed profile
TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94
US10529697B2Jan 7, 2020
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10290530B2May 14, 2019
Info structure with copper pillar having reversed profile
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10128182B2Nov 13, 2018
Semiconductor package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10692809B2Jun 23, 2020
Manufacturing method for semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12261074B2Mar 25, 2025
Info structure with copper pillar having reversed profile
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11990454B2May 21, 2024
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11984342B2May 14, 2024
Info structure with copper pillar having reversed profile
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11948881B2Apr 2, 2024
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11069614B2Jul 20, 2021
Semiconductor package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10950478B2Mar 16, 2021
Info structure with copper pillar having reversed profile
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10290590B2May 14, 2019
Stacked semiconductor device and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US10867973B2Dec 15, 2020
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52