Inventor
CHANG CHING-FU
TW39 patents
⚠️ This page may combine multiple inventors who share the name “CHANG CHING-FU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
31 patentsUS9837359B1Dec 5, 2017
Integrated fan-out package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD43 citations98
US9922896B1Mar 20, 2018
Info structure with copper pillar having reversed profile
TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94
US10529697B2Jan 7, 2020
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10290530B2May 14, 2019
Info structure with copper pillar having reversed profile
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10276506B2Apr 30, 2019
Integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10128182B2Nov 13, 2018
Semiconductor package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9922895B2Mar 20, 2018
Package with tilted interface between device die and encapsulating material
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US11362037B2Jun 14, 2022
Integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11322419B2May 3, 2022
Package with tilted interface between device die and encapsulating material
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10790235B2Sep 29, 2020
Integrated fan-out package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10770402B2Sep 8, 2020
Integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10692809B2Jun 23, 2020
Manufacturing method for semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10170430B2Jan 1, 2019
Integrated fan-out package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10163745B2Dec 25, 2018
Package with tilted interface between device die and encapsulating material
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10109589B2Oct 23, 2018
Integrated fan-out package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10037961B2Jul 31, 2018
Integrated fan-out package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US12334406B2Jun 17, 2025
Package with tilted interface between device die and encapsulating material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12261074B2Mar 25, 2025
Info structure with copper pillar having reversed profile
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11990454B2May 21, 2024
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11984342B2May 14, 2024
Info structure with copper pillar having reversed profile
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11948881B2Apr 2, 2024
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901303B2Feb 13, 2024
Integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11854993B2Dec 26, 2023
Integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11282796B2Mar 22, 2022
Integrated fan-out package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11069614B2Jul 20, 2021
Semiconductor package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10950478B2Mar 16, 2021
Info structure with copper pillar having reversed profile
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10879185B2Dec 29, 2020
Package structure with bump
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10867973B2Dec 15, 2020
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10734299B2Aug 4, 2020
Package with tilted interface between device die and encapsulating material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10515899B2Dec 24, 2019
Package structure with bump
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9941216B2Apr 10, 2018
Conductive pattern and integrated fan-out package having the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations49
OPEN TEXT SA ULC
3 patentsUS9686374B2Jun 20, 2017
System and method for fragment level dynamic content regeneration
OPEN TEXT SA ULC6 citations83
US10235471B2Mar 19, 2019
System and method for the dynamic provisioning of static content
OPEN TEXT SA ULC2 citations72
US12067074B2Aug 20, 2024
System and method for the dynamic provisioning of static content
OPEN TEXT SA ULC0 citations61
RAJKUMAR N ISAAC
3 patentsUS8924411B2Dec 30, 2014
System and method for the dynamic provisioning of static content
RAJKUMAR N ISAAC7 citations82
US8260802B2Sep 4, 2012
System using content generator for dynamically regenerating one or more fragments of web page based on notification of content change
RAJKUMAR N ISAAC7 citations82
US8433724B2Apr 30, 2013
System using content generator for dynamically regenerating one or more fragments of web page based on notification of content change
RAJKUMAR N ISAAC7 citations81