P

Inventor

HUANG HSIN-CHIEH

TW109 patents
⚠️ This page may combine multiple inventors who share the name “HUANG HSIN-CHIEH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

32 patents
US9837359B1Dec 5, 2017

Integrated fan-out package and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD43 citations98
US9922896B1Mar 20, 2018

Info structure with copper pillar having reversed profile

TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94
US9905467B2Feb 27, 2018

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD19 citations94
US9722050B2Aug 1, 2017

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD14 citations92
US10529697B2Jan 7, 2020

Package structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10505001B2Dec 10, 2019

Semiconductor device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10290530B2May 14, 2019

Info structure with copper pillar having reversed profile

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10276506B2Apr 30, 2019

Integrated fan-out package

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10163717B2Dec 25, 2018

Method of forming FinFET device by adjusting etch selectivity of dielectric layer

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10128182B2Nov 13, 2018

Semiconductor package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10032873B2Jul 24, 2018

Semiconductor device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US9922895B2Mar 20, 2018

Package with tilted interface between device die and encapsulating material

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US11749724B2Sep 5, 2023

Semiconductor device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11362037B2Jun 14, 2022

Integrated fan-out package

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11322419B2May 3, 2022

Package with tilted interface between device die and encapsulating material

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10998235B2May 4, 2021

FinFET with sloped surface at interface between isolation structures and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10964801B2Mar 30, 2021

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10790235B2Sep 29, 2020

Integrated fan-out package and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10770402B2Sep 8, 2020

Integrated fan-out package

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10727135B2Jul 28, 2020

FinFET with sloped surface at interface between isolation structures and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10692809B2Jun 23, 2020

Manufacturing method for semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10504787B2Dec 10, 2019

FinFET with sloped surface at interface between isolation structures

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10468504B2Nov 5, 2019

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10170430B2Jan 1, 2019

Integrated fan-out package and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10163745B2Dec 25, 2018

Package with tilted interface between device die and encapsulating material

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10164072B2Dec 25, 2018

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10109589B2Oct 23, 2018

Integrated fan-out package and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10037961B2Jul 31, 2018

Integrated fan-out package and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US9933388B2Apr 3, 2018

Integrated biosensor

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9711463B2Jul 18, 2017

Dicing method for power transistors

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9647122B2May 9, 2017

Semiconductor device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9488615B2Nov 8, 2016

Biosensor with a sensing surface on an interlayer dielectric

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73

TAIWAN SEMICONDUCTOR MFG

5 patents

HUANG HSIN-CHIEH

5 patents

TSMC SOLID STATE LIGHTING LTD

3 patents

CHUN KUANG OPTICS CORP

2 patents

AXON TECHNOLOGIES CORP

1 patent

CHIANG MING CHOU

1 patent

TECO ELECTRONIC & MACHINERY CO LTD

1 patent

Showing the top 50 of 109 patents by PatentIndex Score.