Inventor
HUANG HSIN-CHIEH
TW109 patents
⚠️ This page may combine multiple inventors who share the name “HUANG HSIN-CHIEH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
32 patentsUS9837359B1Dec 5, 2017
Integrated fan-out package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD43 citations98
US9922896B1Mar 20, 2018
Info structure with copper pillar having reversed profile
TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94
US9905467B2Feb 27, 2018
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD19 citations94
US9722050B2Aug 1, 2017
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD14 citations92
US10529697B2Jan 7, 2020
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10505001B2Dec 10, 2019
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10290530B2May 14, 2019
Info structure with copper pillar having reversed profile
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10276506B2Apr 30, 2019
Integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10163717B2Dec 25, 2018
Method of forming FinFET device by adjusting etch selectivity of dielectric layer
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10128182B2Nov 13, 2018
Semiconductor package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10032873B2Jul 24, 2018
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US9922895B2Mar 20, 2018
Package with tilted interface between device die and encapsulating material
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US11749724B2Sep 5, 2023
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11362037B2Jun 14, 2022
Integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11322419B2May 3, 2022
Package with tilted interface between device die and encapsulating material
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10998235B2May 4, 2021
FinFET with sloped surface at interface between isolation structures and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10964801B2Mar 30, 2021
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10790235B2Sep 29, 2020
Integrated fan-out package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10770402B2Sep 8, 2020
Integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10727135B2Jul 28, 2020
FinFET with sloped surface at interface between isolation structures and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10692809B2Jun 23, 2020
Manufacturing method for semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10504787B2Dec 10, 2019
FinFET with sloped surface at interface between isolation structures
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10468504B2Nov 5, 2019
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10170430B2Jan 1, 2019
Integrated fan-out package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10163745B2Dec 25, 2018
Package with tilted interface between device die and encapsulating material
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10164072B2Dec 25, 2018
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10109589B2Oct 23, 2018
Integrated fan-out package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10037961B2Jul 31, 2018
Integrated fan-out package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US9933388B2Apr 3, 2018
Integrated biosensor
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9711463B2Jul 18, 2017
Dicing method for power transistors
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9647122B2May 9, 2017
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9488615B2Nov 8, 2016
Biosensor with a sensing surface on an interlayer dielectric
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
TAIWAN SEMICONDUCTOR MFG
5 patentsUS5454871AOct 3, 1995
SOG coated apparatus to solve SOG non-uniformity in the VLSI process
TAIWAN SEMICONDUCTOR MFG65 citations94
US5731243AMar 24, 1998
Method of cleaning residue on a semiconductor wafer bonding pad
TAIWAN SEMICONDUCTOR MFG66 citations93
US6727184B1Apr 27, 2004
Method for coating a thick spin-on-glass layer on a semiconductor structure
TAIWAN SEMICONDUCTOR MFG20 citations91
US6179691B1Jan 30, 2001
Method for endpoint detection for copper CMP
TAIWAN SEMICONDUCTOR MFG21 citations90
US5434096AJul 18, 1995
Method to prevent silicide bubble in the VLSI process
TAIWAN SEMICONDUCTOR MFG28 citations89
HUANG HSIN-CHIEH
5 patentsUS8624505B2Jan 7, 2014
Light color and intensity adjustable LED
HUANG HSIN-CHIEH23 citations92
US8604498B2Dec 10, 2013
Single phosphor layer photonic device for generating white light or color lights
HUANG HSIN-CHIEH11 citations84
US8476918B2Jul 2, 2013
Apparatus and method for wafer level classification of light emitting device
HUANG HSIN-CHIEH14 citations84
US8523407B2Sep 3, 2013
Optical element and illuminant device using the same
HUANG HSIN-CHIEH12 citations78
US8981397B2Mar 17, 2015
Light-emitting devices on textured substrates
HUANG HSIN-CHIEH4 citations73
TSMC SOLID STATE LIGHTING LTD
3 patentsUS9153739B2Oct 6, 2015
Light emitting devices with textured active layer
TSMC SOLID STATE LIGHTING LTD6 citations84
US9125272B2Sep 1, 2015
Light color and intensity adjustable LED
TSMC SOLID STATE LIGHTING LTD5 citations84
US9029175B2May 12, 2015
Single phosphor layer photonic device for generating white light or color lights
TSMC SOLID STATE LIGHTING LTD10 citations84
CHUN KUANG OPTICS CORP
2 patentsAXON TECHNOLOGIES CORP
1 patentCHIANG MING CHOU
1 patentTECO ELECTRONIC & MACHINERY CO LTD
1 patentShowing the top 50 of 109 patents by PatentIndex Score.