Inventor
WANG ZHIJIE
US88 patents
⚠️ This page may combine multiple inventors who share the name “WANG ZHIJIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ACCENTURE GLOBAL SOLUTIONS LTD
7 patentsUS10296524B1May 21, 2019
Data virtualization using leveraged semantic knowledge in a knowledge graph
ACCENTURE GLOBAL SOLUTIONS LTD23 citations92
US11934390B2Mar 19, 2024
Approaches for knowledge graph pruning based on sampling and information gain theory
ACCENTURE GLOBAL SOLUTIONS LTD2 citations73
US10614086B2Apr 7, 2020
Orchestrated hydration of a knowledge graph
ACCENTURE GLOBAL SOLUTIONS LTD3 citations71
US11501177B2Nov 15, 2022
Knowledge engineering and reasoning on a knowledge graph
ACCENTURE GLOBAL SOLUTIONS LTD4 citations70
US11983636B2May 14, 2024
Automated analytical model retraining with a knowledge graph
ACCENTURE GLOBAL SOLUTIONS LTD3 citations69
US11693848B2Jul 4, 2023
Approaches for knowledge graph pruning based on sampling and information gain theory
ACCENTURE GLOBAL SOLUTIONS LTD0 citations62
US10650340B2May 12, 2020
Tracking and/or analyzing facility-related activities
ACCENTURE GLOBAL SOLUTIONS LTD1 citations56
FREESCALE SEMICONDUCTOR INC
6 patentsUS9548255B1Jan 17, 2017
IC package having non-horizontal die pad and flexible substrate therefor
FREESCALE SEMICONDUCTOR INC7 citations83
US9379035B1Jun 28, 2016
IC package having non-horizontal die pad and lead frame therefor
FREESCALE SEMICONDUCTOR INC7 citations83
US9355945B1May 31, 2016
Semiconductor device with heat-dissipating lead frame
FREESCALE SEMICONDUCTOR INC12 citations83
US10041195B2Aug 7, 2018
Woven signal-routing substrate for wearable electronic devices
FREESCALE SEMICONDUCTOR INC3 citations72
US9362212B1Jun 7, 2016
Integrated circuit package having side and bottom contact pads
FREESCALE SEMICONDUCTOR INC3 citations69
US9449901B1Sep 20, 2016
Lead frame with deflecting tie bar for IC package
FREESCALE SEMICONDUCTOR INC2 citations62
QUALCOMM INC
5 patentsUS11581251B2Feb 14, 2023
Package comprising inter-substrate gradient interconnect structure
QUALCOMM INC0 citations62
US11322490B2May 3, 2022
Modular capacitor array
QUALCOMM INC0 citations62
US11289453B2Mar 29, 2022
Package comprising a substrate and a high-density interconnect structure coupled to the substrate
QUALCOMM INC1 citations62
US10971455B2Apr 6, 2021
Ground shield plane for ball grid array (BGA) package
QUALCOMM INC0 citations62
US10679919B2Jun 9, 2020
High thermal release interposer
QUALCOMM INC1 citations59
SHENZHEN BESTWO E COMMERCE CO LTD
4 patentsUSD902582SNov 24, 2020
Expandable pet backpack
SHENZHEN BESTWO E COMMERCE CO LTD24 citations93
USD921139SJun 1, 2021
Inflatable waterslide
SHENZHEN BESTWO E COMMERCE CO LTD13 citations85
USD984798SMay 2, 2023
Pet treat bag
SHENZHEN BESTWO E COMMERCE CO LTD4 citations74
USD914297SMar 23, 2021
Portable pet carrier bag
SHENZHEN BESTWO E COMMERCE CO LTD4 citations72
NXP USA INC
4 patentsUS9890034B2Feb 13, 2018
Cavity type pressure sensor device
NXP USA INC2 citations73
US11515238B2Nov 29, 2022
Power die package
NXP USA INC2 citations72
US11456188B2Sep 27, 2022
Method of making flexible semiconductor device with graphene tape
NXP USA INC0 citations62
US11984408B2May 14, 2024
Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation
NXP USA INC0 citations58
SHENZHEN HUAJIE TECH CO LTD
3 patentsKULICKE & SOFFA IND INC
3 patentsUS7523848B2Apr 28, 2009
Method and apparatus for measuring the size of free air balls on a wire bonder
KULICKE & SOFFA IND INC9 citations81
US9810641B2Nov 7, 2017
Systems and methods for measuring physical characteristics of semiconductor device elements using structured light
KULICKE & SOFFA IND INC7 citations80
US12538759B2Jan 27, 2026
Methods of determining a height, and a height profile, of a wire loop on a wire bonding machine
KULICKE & SOFFA IND INC0 citations54
INVISION AI INC
3 patentsXIAMEN TIANMA MICRO ELECTRONICS CO LTD
3 patentsUS11830418B2Nov 28, 2023
Pixel driving circuit and driving method thereof, light-emitting panel, and display device
XIAMEN TIANMA MICRO ELECTRONICS CO LTD2 citations72
US12322355B1Jun 3, 2025
Display panel, display panel driving method and display device
XIAMEN TIANMA MICRO ELECTRONICS CO LTD1 citations56
US11205396B2Dec 21, 2021
Display panel, method for driving display panel, and display device
XIAMEN TIANMA MICRO ELECTRONICS CO LTD0 citations56
WANG ZHIJIE
2 patentsCONVERGENT DENTAL INC
2 patentsChen wei min
1 patentAPOLLO INTELLIGENT DRIVING TECHNOLOGY BEIJING CO LTD
1 patentUNIV ARIZONA STATE
1 patentHUANG DIJIANG
1 patentXU YANBO
1 patentBAI ZHIGANG
1 patentLI ZHE
1 patentGE YOU
1 patentShowing the top 50 of 88 patents by PatentIndex Score.