Inventor
ARNOLD RICHARD W
US18 patents
⚠️ This page may combine multiple inventors who share the name “ARNOLD RICHARD W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
15 patentsUS7026833B2Apr 11, 2006
Multiple-chip probe and universal tester contact assemblage
TEXAS INSTRUMENTS INC123 citations98
US6970005B2Nov 29, 2005
Multiple-chip probe and universal tester contact assemblage
TEXAS INSTRUMENTS INC47 citations95
US6906539B2Jun 14, 2005
High density, area array probe card apparatus
TEXAS INSTRUMENTS INC63 citations94
US6720574B2Apr 13, 2004
Method of testing a semiconductor chip
TEXAS INSTRUMENTS INC23 citations89
US5649981AJul 22, 1997
Tool and fixture for the removal of tab leads bonded to semiconductor die pads
TEXAS INSTRUMENTS INC36 citations88
US6636063B2Oct 21, 2003
Probe card with contact apparatus and method of manufacture
TEXAS INSTRUMENTS INC18 citations82
US6376352B1Apr 23, 2002
Stud-cone bump for probe tips used in known good die carriers
TEXAS INSTRUMENTS INC15 citations82
US6209532B1Apr 3, 2001
Soft handling process tooling for low and medium volume known good die product
TEXAS INSTRUMENTS INC8 citations72
US6553661B2Apr 29, 2003
Semiconductor test structure having a laser defined current carrying structure
TEXAS INSTRUMENTS INC10 citations71
US6489673B2Dec 3, 2002
Digital signal processor/known good die packaging using rerouted existing package for test and burn-in carriers
TEXAS INSTRUMENTS INC5 citations70
US7898275B1Mar 1, 2011
Known good die using existing process infrastructure
TEXAS INSTRUMENTS INC3 citations60
US6720780B2Apr 13, 2004
High density probe card apparatus and method of manufacture
TEXAS INSTRUMENTS INC0 citations51
US7122895B2Oct 17, 2006
Stud-cone bump for probe tips used in known good die carriers
TEXAS INSTRUMENTS INC1 citations50
US6335226B1Jan 1, 2002
Digital signal processor/known good die packaging using rerouted existing package for test and burn-in carriers
TEXAS INSTRUMENTS INC1 citations48
US5591649AJan 7, 1997
Process of removing a tape automated bonded semiconductor from bonded leads
TEXAS INSTRUMENTS INC1 citations48
IBM
2 patentsUS10515069B2Dec 24, 2019
Utilization of a concept to obtain data of specific interest to a user from one or more data storage locations
IBM0 citations46
US10445310B2Oct 15, 2019
Utilization of a concept to obtain data of specific interest to a user from one or more data storage locations
IBM0 citations46