Inventor
MIYAZAWA RISA
JP9 patents
Patents
9 patentsUS11264314B2Mar 1, 2022
Interconnection with side connection to substrate
IBM6 citations73
US11004819B2May 11, 2021
Prevention of bridging between solder joints
IBM3 citations72
US11574817B2Feb 7, 2023
Fabricating an interconnection using a sacrificial layer
IBM2 citations71
US11908723B2Feb 20, 2024
Silicon handler with laser-release layers
IBM0 citations62
US11164845B2Nov 2, 2021
Resist structure for forming bumps
IBM0 citations62
US11456269B2Sep 27, 2022
Prevention of bridging between solder joints
IBM0 citations61
US10903526B2Jan 26, 2021
Electron device stack structure
IBM0 citations61
US12315775B2May 27, 2025
Underfill vacuum process
IBM0 citations59
US11735529B2Aug 22, 2023
Side pad anchored by next adjacent via
IBM0 citations50