Inventor

OKAMOTO KEISHI

JP34 patents

⚠️ This page may combine multiple inventors who share the name “OKAMOTO KEISHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OKAMOTO KEISHI

IBM

Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide

Interconnection with side connection to substrate

Controlling of height of high-density interconnection structure on substrate

High-density interconnecting adhesive tape

High-density interconnecting adhesive tape

Prevention of bridging between solder joints

Method of reducing warpage of an organic substrate

Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide

Circuit board formation using organic substrates

Chip mounting structure

Controlling of height of high-density interconnection structure on substrate

Prevention of bridging between solder joints

Fabrication of a sacrificial interposer test structure

Chip mounting structure

Fabrication of sacrificial interposer test structure

Wireless communication device with joined semiconductors

Method of reducing warpage of an orgacnic substrate

Wireless communication device with joined semiconductors

Circuit board formation using organic substrates

Electrical connecting structure between a substrate and a semiconductor chip

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Shuffling device, coding device, decoding device of video signal and medium recording the programs of shuffling, coding and decoding

Apparatus and method for image coding and recording/reproducing

Recording and reproducing apparatus

TOYO ADVANCED TECH CO

Medical device having diamond-like thin film and method for manufacturing thereof

Method for manufacturing an implant material

HITACHI MEDICAL CORP

Graphical user interface for a computer monitor of an X-ray tomography scanner

ELAD DANNY

Electronic package for millimeter wave semiconductor dies

OKAMOTO KEISHI

Ballpoint pen tip and ballpoint pen

GRAF RICHARD S

Integrated circuit chip incorporating embedded thermal radiators for localized, on-demand, heating and a system and method for designing such an integrated circuit chip

BULDON CO LTD

Head cover for a golf club

PANASONIC CORP

Recording apparatus, editing apparatus, digital video recording system, and file format

NAKATANI TATSUYUKI

Stent and method for fabricating the same

ABE YOSHINORI

Method for fabricating material

MOCHIZUKI AKIRA

Implant material