Inventor
LEE JUNG CHAN
US18 patents
⚠️ This page may combine multiple inventors who share the name “LEE JUNG CHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
8 patentsUS9570287B2Feb 14, 2017
Flowable film curing penetration depth improvement and stress tuning
APPLIED MATERIALS INC7 citations84
US11170994B1Nov 9, 2021
CD dependent gap fill and conformal films
APPLIED MATERIALS INC3 citations72
US11804372B2Oct 31, 2023
CD dependent gap fill and conformal films
APPLIED MATERIALS INC0 citations62
US11152248B2Oct 19, 2021
Cyclic flowable deposition and high-density plasma treatment processes for high quality gap fill solutions
APPLIED MATERIALS INC1 citations62
US10707116B2Jul 7, 2020
Cyclic flowable deposition and high-density plasma treatment processes for high quality gap fill solutions
APPLIED MATERIALS INC1 citations62
US12230499B2Feb 18, 2025
Methods of post treating silicon nitride based dielectric films with high energy low dose plasma
APPLIED MATERIALS INC0 citations59
US10041167B2Aug 7, 2018
Cyclic sequential processes for forming high quality thin films
APPLIED MATERIALS INC1 citations51
US12094709B2Sep 17, 2024
Plasma treatment process to densify oxide layers
APPLIED MATERIALS INC0 citations47
LEE JUNG-CHAN
4 patentsUS8916936B2Dec 23, 2014
Transistor structure of a semiconductor device
LEE JUNG-CHAN15 citations91
US8399363B1Mar 19, 2013
Methods of forming oxide-filled trenches in substrates using multiple-temperature oxide deposition techniques
LEE JUNG-CHAN16 citations82
US8617991B2Dec 31, 2013
Method of manufacturing semiconductor device
LEE JUNG-CHAN2 citations60
US8691642B2Apr 8, 2014
Method of fabricating semiconductor device including forming epitaxial blocking layers by nitridation process
LEE JUNG-CHAN1 citations50