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Inventor

SRINIVASAN MUKUND

US50 patents
⚠️ This page may combine multiple inventors who share the name “SRINIVASAN MUKUND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

25 patents
US9412581B2Aug 9, 2016

Low-K dielectric gapfill by flowable deposition

APPLIED MATERIALS INC396 citations98
US9412613B2Aug 9, 2016

Development of high etch selective hardmask material by ion implantation into amorphous carbon films

APPLIED MATERIALS INC54 citations98
US10056279B2Aug 21, 2018

Semiconductor process equipment

APPLIED MATERIALS INC22 citations94
US10998329B2May 4, 2021

Methods and apparatus for three dimensional NAND structure fabrication

APPLIED MATERIALS INC11 citations85
US10734265B2Aug 4, 2020

Semiconductor process equipment

APPLIED MATERIALS INC13 citations85
US10236197B2Mar 19, 2019

Processing system containing an isolation region separating a deposition chamber from a treatment chamber

APPLIED MATERIALS INC11 citations84
US10403535B2Sep 3, 2019

Method and apparatus of processing wafers with compressive or tensile stress at elevated temperatures in a plasma enhanced chemical vapor deposition system

APPLIED MATERIALS INC11 citations83
US12334354B2Jun 17, 2025

Sidewall passivation for plasma etching

APPLIED MATERIALS INC2 citations74
US9624577B2Apr 18, 2017

Deposition of metal doped amorphous carbon film

APPLIED MATERIALS INC2 citations73
US9406509B2Aug 2, 2016

Deposition of heteroatom-doped carbon films

APPLIED MATERIALS INC5 citations73
US10460936B2Oct 29, 2019

Photo-assisted deposition of flowable films

APPLIED MATERIALS INC3 citations72
US11948783B2Apr 2, 2024

Dynamic phased array plasma source for complete plasma coverage of a moving substrate

APPLIED MATERIALS INC1 citations62
US11705335B2Jul 18, 2023

Conformal high concentration boron doping of semiconductors

APPLIED MATERIALS INC0 citations62
US11545504B2Jan 3, 2023

Methods and apparatus for three dimensional NAND structure fabrication

APPLIED MATERIALS INC0 citations62
US11430801B2Aug 30, 2022

Methods and apparatus for three dimensional NAND structure fabrication

APPLIED MATERIALS INC0 citations62
US11328928B2May 10, 2022

Conformal high concentration boron doping of semiconductors

APPLIED MATERIALS INC0 citations62
US11189635B2Nov 30, 2021

3D-NAND mold

APPLIED MATERIALS INC0 citations62
US11152248B2Oct 19, 2021

Cyclic flowable deposition and high-density plasma treatment processes for high quality gap fill solutions

APPLIED MATERIALS INC1 citations62
US10707116B2Jul 7, 2020

Cyclic flowable deposition and high-density plasma treatment processes for high quality gap fill solutions

APPLIED MATERIALS INC1 citations62
US12464716B2Nov 4, 2025

NAND cell structure with charge trap cut

APPLIED MATERIALS INC0 citations52
US9613908B2Apr 4, 2017

Ultra-thin dielectric diffusion barrier and etch stop layer for advanced interconnect applications

APPLIED MATERIALS INC1 citations52
US11276569B2Mar 15, 2022

On stack overlay improvement for 3D NAND

APPLIED MATERIALS INC0 citations51
US10475644B2Nov 12, 2019

Dielectric-metal stack for 3D flash memory application

APPLIED MATERIALS INC0 citations51
US10041167B2Aug 7, 2018

Cyclic sequential processes for forming high quality thin films

APPLIED MATERIALS INC1 citations51
US9972487B2May 15, 2018

Dielectric-metal stack for 3D flash memory application

APPLIED MATERIALS INC1 citations51

LAM RES CORP

15 patents
US6391787B1May 21, 2002

Stepped upper electrode for plasma processing uniformity

LAM RES CORP153 citations99
US6824627B2Nov 30, 2004

Stepped upper electrode for plasma processing uniformity

LAM RES CORP104 citations98
US7094315B2Aug 22, 2006

Chamber configuration for confining a plasma

LAM RES CORP46 citations96
US6872281B1Mar 29, 2005

Chamber configuration for confining a plasma

LAM RES CORP66 citations96
US7749353B2Jul 6, 2010

High aspect ratio etch using modulation of RF powers of various frequencies

LAM RES CORP30 citations92
US7547635B2Jun 16, 2009

Process for etching dielectric films with improved resist and/or etch profile characteristics

LAM RES CORP21 citations92
US7144521B2Dec 5, 2006

High aspect ratio etch using modulation of RF powers of various frequencies

LAM RES CORP24 citations92
US6984288B2Jan 10, 2006

Plasma processor in plasma confinement region within a vacuum chamber

LAM RES CORP52 citations92
US6714033B1Mar 30, 2004

Probe for direct wafer potential measurements

LAM RES CORP45 citations92
US7405521B2Jul 29, 2008

Multiple frequency plasma processor method and apparatus

LAM RES CORP35 citations91
US6942816B2Sep 13, 2005

Methods of reducing photoresist distortion while etching in a plasma processing system

LAM RES CORP14 citations83
US7645707B2Jan 12, 2010

Etch profile control

LAM RES CORP7 citations73
US7976673B2Jul 12, 2011

RF pulsing of a narrow gap capacitively coupled reactor

LAM RES CORP4 citations63
US10332727B2Jun 25, 2019

Methods for processing substrates using small plasma chambers

LAM RES CORP0 citations52
US9911578B2Mar 6, 2018

Small plasma chamber systems and methods

LAM RES CORP0 citations52

DHINDSA RAJINDER

2 patents

VMWARE INC

2 patents

TAYLOR TRAVIS R

1 patent

GOTTSCHO RICHARD

1 patent

TRANSF SR BRANDS LLC

1 patent

GUPTA ANUBHAV

1 patent

LOEWENHARDT PETER

1 patent

ITTIAM SYSTEMS PTE LTD

1 patent