Inventor
SRINIVASAN MUKUND
US50 patents
⚠️ This page may combine multiple inventors who share the name “SRINIVASAN MUKUND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
25 patentsUS9412581B2Aug 9, 2016
Low-K dielectric gapfill by flowable deposition
APPLIED MATERIALS INC396 citations98
US9412613B2Aug 9, 2016
Development of high etch selective hardmask material by ion implantation into amorphous carbon films
APPLIED MATERIALS INC54 citations98
US10056279B2Aug 21, 2018
Semiconductor process equipment
APPLIED MATERIALS INC22 citations94
US10998329B2May 4, 2021
Methods and apparatus for three dimensional NAND structure fabrication
APPLIED MATERIALS INC11 citations85
US10734265B2Aug 4, 2020
Semiconductor process equipment
APPLIED MATERIALS INC13 citations85
US10236197B2Mar 19, 2019
Processing system containing an isolation region separating a deposition chamber from a treatment chamber
APPLIED MATERIALS INC11 citations84
US10403535B2Sep 3, 2019
Method and apparatus of processing wafers with compressive or tensile stress at elevated temperatures in a plasma enhanced chemical vapor deposition system
APPLIED MATERIALS INC11 citations83
US12334354B2Jun 17, 2025
Sidewall passivation for plasma etching
APPLIED MATERIALS INC2 citations74
US9624577B2Apr 18, 2017
Deposition of metal doped amorphous carbon film
APPLIED MATERIALS INC2 citations73
US9406509B2Aug 2, 2016
Deposition of heteroatom-doped carbon films
APPLIED MATERIALS INC5 citations73
US10460936B2Oct 29, 2019
Photo-assisted deposition of flowable films
APPLIED MATERIALS INC3 citations72
US11948783B2Apr 2, 2024
Dynamic phased array plasma source for complete plasma coverage of a moving substrate
APPLIED MATERIALS INC1 citations62
US11705335B2Jul 18, 2023
Conformal high concentration boron doping of semiconductors
APPLIED MATERIALS INC0 citations62
US11545504B2Jan 3, 2023
Methods and apparatus for three dimensional NAND structure fabrication
APPLIED MATERIALS INC0 citations62
US11430801B2Aug 30, 2022
Methods and apparatus for three dimensional NAND structure fabrication
APPLIED MATERIALS INC0 citations62
US11328928B2May 10, 2022
Conformal high concentration boron doping of semiconductors
APPLIED MATERIALS INC0 citations62
US11189635B2Nov 30, 2021
3D-NAND mold
APPLIED MATERIALS INC0 citations62
US11152248B2Oct 19, 2021
Cyclic flowable deposition and high-density plasma treatment processes for high quality gap fill solutions
APPLIED MATERIALS INC1 citations62
US10707116B2Jul 7, 2020
Cyclic flowable deposition and high-density plasma treatment processes for high quality gap fill solutions
APPLIED MATERIALS INC1 citations62
US12464716B2Nov 4, 2025
NAND cell structure with charge trap cut
APPLIED MATERIALS INC0 citations52
US9613908B2Apr 4, 2017
Ultra-thin dielectric diffusion barrier and etch stop layer for advanced interconnect applications
APPLIED MATERIALS INC1 citations52
US11276569B2Mar 15, 2022
On stack overlay improvement for 3D NAND
APPLIED MATERIALS INC0 citations51
US10475644B2Nov 12, 2019
Dielectric-metal stack for 3D flash memory application
APPLIED MATERIALS INC0 citations51
US10041167B2Aug 7, 2018
Cyclic sequential processes for forming high quality thin films
APPLIED MATERIALS INC1 citations51
US9972487B2May 15, 2018
Dielectric-metal stack for 3D flash memory application
APPLIED MATERIALS INC1 citations51
LAM RES CORP
15 patentsUS6391787B1May 21, 2002
Stepped upper electrode for plasma processing uniformity
LAM RES CORP153 citations99
US6824627B2Nov 30, 2004
Stepped upper electrode for plasma processing uniformity
LAM RES CORP104 citations98
US7094315B2Aug 22, 2006
Chamber configuration for confining a plasma
LAM RES CORP46 citations96
US6872281B1Mar 29, 2005
Chamber configuration for confining a plasma
LAM RES CORP66 citations96
US7749353B2Jul 6, 2010
High aspect ratio etch using modulation of RF powers of various frequencies
LAM RES CORP30 citations92
US7547635B2Jun 16, 2009
Process for etching dielectric films with improved resist and/or etch profile characteristics
LAM RES CORP21 citations92
US7144521B2Dec 5, 2006
High aspect ratio etch using modulation of RF powers of various frequencies
LAM RES CORP24 citations92
US6984288B2Jan 10, 2006
Plasma processor in plasma confinement region within a vacuum chamber
LAM RES CORP52 citations92
US6714033B1Mar 30, 2004
Probe for direct wafer potential measurements
LAM RES CORP45 citations92
US7405521B2Jul 29, 2008
Multiple frequency plasma processor method and apparatus
LAM RES CORP35 citations91
US6942816B2Sep 13, 2005
Methods of reducing photoresist distortion while etching in a plasma processing system
LAM RES CORP14 citations83
US7645707B2Jan 12, 2010
Etch profile control
LAM RES CORP7 citations73
US7976673B2Jul 12, 2011
RF pulsing of a narrow gap capacitively coupled reactor
LAM RES CORP4 citations63
US10332727B2Jun 25, 2019
Methods for processing substrates using small plasma chambers
LAM RES CORP0 citations52
US9911578B2Mar 6, 2018
Small plasma chamber systems and methods
LAM RES CORP0 citations52