Inventor

KAO MIN-FENG

TW139 patents

⚠️ This page may combine multiple inventors who share the name “KAO MIN-FENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KAO MIN-FENG

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor device structure with a conductive feature passing through a passivation layer

Structure for standard logic performance improvement having a back-side through-substrate-via

Structure for stacked logic performance improvement

Structure for standard logic performance improvement having a back-side through-substrate-via

Hybrid bonding technology for stacking integrated circuits

Integrated circuit (IC) structure for high performance and functional density

Semiconductor devices, methods of manufacturing thereof, and image sensor devices

Interconnect apparatus and method

Backside contact for thermal displacement in a multi-wafer stacked integrated circuit

Hybrid bonding technology for stacking integrated circuits

Through silicon vias and methods of fabricating thereof

Semiconductor structure and manufacturing method thereof

Image sensor

Stacked semiconductor device and method

Oversized via as through-substrate-via (TSV) stop layer

Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same

Hybrid bonding technology for stacking integrated circuits

Backside capacitor techniques

Hybrid bonding technology for stacking integrated circuits

Oversized via as through-substrate-via (TSV) stop layer

Integrated circuit (IC) structure for high performance and functional density

Structure and method for 3D image sensor

Semiconductor device and manufacturing method thereof

Semiconductor structure and method for manufacturing the same

Interconnect structure for stacked device and method

Inductor structure for integrated circuit

Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same

Semiconductor structure and method for manufacturing the same

Interconnect structure for stacked device and method

Varied STI liners for isolation structures in image sensing devices

CMOS image sensor and method for forming the same

Interconnect structure for stacked device and method

Backside structure and methods for BSI image sensors

Frontside illuminated (FSI) image sensor with a reflector

Method and apparatus for low resistance image sensor contact

Backside structure and methods for BSI image sensors

TAIWAN SEMICONDUCTOR MFG

Backside structure for a BSI image sensor device

Semiconductor devices, methods of manufacturing thereof, and image sensor devices

Backside structure and method for BSI image sensors

Semiconductor switching device separated by device isolation

Imaging sensor structure and method

Varied STI liners for isolation structures in image sensing devices

Backside structure and methods for BSI image sensors

System and method for fabricating a 3D image sensor structure

CHUANG CHUN-CHIEH

Backside structure and methods for BSI image sensors

LIN JENG-SHYAN

Apparatus and method for reducing cross talk in image sensors

CHEN SZU-YING

Method of forming an image device

KAO MIN-FENG

System and method for fabricating a 3D image sensor structure

TSENG HSIAO-HUI

Multiple gate dielectric structures and methods of forming the same

CHOU KENG-YU

Back side illuminated image sensor with improved stress immunity