Inventor

QUEVEDO NANETTE

US2 patents

⚠️ This page may combine multiple inventors who share the name “QUEVEDO NANETTE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

1 patent

US9374902B2Jun 21, 2016

Package including an underfill material in a portion of an area between the package and a substrate or another package

MICRON TECHNOLOGY INC2 citations55

YIM MYUNG JIN

1 patent

US8451620B2May 28, 2013

Package including an underfill material in a portion of an area between the package and a substrate or another package

YIM MYUNG JIN2 citations54