P

Inventor

NAKATA YOSUKE

JP28 patents
⚠️ This page may combine multiple inventors who share the name “NAKATA YOSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUBISHI ELECTRIC CORP

26 patents
US10388589B2Aug 20, 2019

Semiconductor device, inverter device, and vehicle

MITSUBISHI ELECTRIC CORP11 citations84
US11901341B2Feb 13, 2024

Semiconductor package and production method thereof, and semiconductor device

MITSUBISHI ELECTRIC CORP2 citations73
US11025245B2Jun 1, 2021

Power conversion device

MITSUBISHI ELECTRIC CORP3 citations73
US12599048B2Apr 7, 2026

Semiconductor device comprising submodule having at least an upper surface exposed and method of manufacturing the semiconductor device

MITSUBISHI ELECTRIC CORP0 citations62
US12347814B2Jul 1, 2025

Semiconductor package and semiconductor device

MITSUBISHI ELECTRIC CORP0 citations62
US11430726B2Aug 30, 2022

Semiconductor module

MITSUBISHI ELECTRIC CORP0 citations62
US11387158B2Jul 12, 2022

Semiconductor device and semiconductor element

MITSUBISHI ELECTRIC CORP0 citations62
US11450592B2Sep 20, 2022

Semiconductor package with a plurality of chips having a groove in the encapsulation

MITSUBISHI ELECTRIC CORP0 citations60
US10896863B2Jan 19, 2021

Semiconductor device and method for manufacturing the same

MITSUBISHI ELECTRIC CORP0 citations56
US11887933B2Jan 30, 2024

Manufacturing method of semiconductor device

MITSUBISHI ELECTRIC CORP0 citations52
US11848298B2Dec 19, 2023

Semiconductor apparatus, power module, and manufacturing method of semiconductor apparatus

MITSUBISHI ELECTRIC CORP0 citations52
US11264245B2Mar 1, 2022

Method for manufacturing semiconductor device

MITSUBISHI ELECTRIC CORP0 citations52
US12532793B2Jan 20, 2026

Semiconductor device and method of manufacturing semiconductor device

MITSUBISHI ELECTRIC CORP0 citations51
US12009332B2Jun 11, 2024

Semiconductor device having high yield strength intermediate plate

MITSUBISHI ELECTRIC CORP0 citations51
US11777419B2Oct 3, 2023

Semiconductor device, semiconductor device manufacturing method, and power converter

MITSUBISHI ELECTRIC CORP0 citations51
US11508698B2Nov 22, 2022

Semiconductor package and semiconductor device

MITSUBISHI ELECTRIC CORP0 citations51
US11462516B2Oct 4, 2022

Method of manufacturing semiconductor device

MITSUBISHI ELECTRIC CORP0 citations51
US11302538B2Apr 12, 2022

Semiconductor device manufacturing method

MITSUBISHI ELECTRIC CORP0 citations51
US11251098B2Feb 15, 2022

Semiconductor device, production method therefor, and automobile

MITSUBISHI ELECTRIC CORP0 citations51
US10770376B2Sep 8, 2020

Semiconductor device, inverter unit and automobile

MITSUBISHI ELECTRIC CORP0 citations51
US10177109B2Jan 8, 2019

Method of manufacturing semiconductor device

MITSUBISHI ELECTRIC CORP0 citations51
US9911705B2Mar 6, 2018

Semiconductor device and semiconductor device manufacturing method

MITSUBISHI ELECTRIC CORP0 citations51
US10461049B2Oct 29, 2019

Semiconductor device and manufacturing method therefor

MITSUBISHI ELECTRIC CORP0 citations49
US10157865B2Dec 18, 2018

Semiconductor device with metal film and method for manufacturing semiconductor device with metal film

MITSUBISHI ELECTRIC CORP1 citations48
US10825751B2Nov 3, 2020

Semiconductor device

MITSUBISHI ELECTRIC CORP0 citations41
US10504820B2Dec 10, 2019

Semiconductor module and electric power conversion device

MITSUBISHI ELECTRIC CORP0 citations41

NAKATA YOSUKE

1 patent

HASEGAWA TATSUHIKO

1 patent