Inventor
NAKATA YOSUKE
JP28 patents
⚠️ This page may combine multiple inventors who share the name “NAKATA YOSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
26 patentsUS10388589B2Aug 20, 2019
Semiconductor device, inverter device, and vehicle
MITSUBISHI ELECTRIC CORP11 citations84
US11901341B2Feb 13, 2024
Semiconductor package and production method thereof, and semiconductor device
MITSUBISHI ELECTRIC CORP2 citations73
US11025245B2Jun 1, 2021
Power conversion device
MITSUBISHI ELECTRIC CORP3 citations73
US12599048B2Apr 7, 2026
Semiconductor device comprising submodule having at least an upper surface exposed and method of manufacturing the semiconductor device
MITSUBISHI ELECTRIC CORP0 citations62
US12347814B2Jul 1, 2025
Semiconductor package and semiconductor device
MITSUBISHI ELECTRIC CORP0 citations62
US11430726B2Aug 30, 2022
Semiconductor module
MITSUBISHI ELECTRIC CORP0 citations62
US11387158B2Jul 12, 2022
Semiconductor device and semiconductor element
MITSUBISHI ELECTRIC CORP0 citations62
US11450592B2Sep 20, 2022
Semiconductor package with a plurality of chips having a groove in the encapsulation
MITSUBISHI ELECTRIC CORP0 citations60
US10896863B2Jan 19, 2021
Semiconductor device and method for manufacturing the same
MITSUBISHI ELECTRIC CORP0 citations56
US11887933B2Jan 30, 2024
Manufacturing method of semiconductor device
MITSUBISHI ELECTRIC CORP0 citations52
US11848298B2Dec 19, 2023
Semiconductor apparatus, power module, and manufacturing method of semiconductor apparatus
MITSUBISHI ELECTRIC CORP0 citations52
US11264245B2Mar 1, 2022
Method for manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP0 citations52
US12532793B2Jan 20, 2026
Semiconductor device and method of manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP0 citations51
US12009332B2Jun 11, 2024
Semiconductor device having high yield strength intermediate plate
MITSUBISHI ELECTRIC CORP0 citations51
US11777419B2Oct 3, 2023
Semiconductor device, semiconductor device manufacturing method, and power converter
MITSUBISHI ELECTRIC CORP0 citations51
US11508698B2Nov 22, 2022
Semiconductor package and semiconductor device
MITSUBISHI ELECTRIC CORP0 citations51
US11462516B2Oct 4, 2022
Method of manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP0 citations51
US11302538B2Apr 12, 2022
Semiconductor device manufacturing method
MITSUBISHI ELECTRIC CORP0 citations51
US11251098B2Feb 15, 2022
Semiconductor device, production method therefor, and automobile
MITSUBISHI ELECTRIC CORP0 citations51
US10770376B2Sep 8, 2020
Semiconductor device, inverter unit and automobile
MITSUBISHI ELECTRIC CORP0 citations51
US10177109B2Jan 8, 2019
Method of manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP0 citations51
US9911705B2Mar 6, 2018
Semiconductor device and semiconductor device manufacturing method
MITSUBISHI ELECTRIC CORP0 citations51
US10461049B2Oct 29, 2019
Semiconductor device and manufacturing method therefor
MITSUBISHI ELECTRIC CORP0 citations49
US10157865B2Dec 18, 2018
Semiconductor device with metal film and method for manufacturing semiconductor device with metal film
MITSUBISHI ELECTRIC CORP1 citations48
US10825751B2Nov 3, 2020
Semiconductor device
MITSUBISHI ELECTRIC CORP0 citations41
US10504820B2Dec 10, 2019
Semiconductor module and electric power conversion device
MITSUBISHI ELECTRIC CORP0 citations41