Inventor
HAN SANG CHEOL
KR26 patents
⚠️ This page may combine multiple inventors who share the name “HAN SANG CHEOL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
6 patentsUS12507408B2Dec 23, 2025
Method and structures to reduce resistivity in three-dimensional structures for microelectronic workpieces using material deposited in recesses at edges of holes in a multilayer stack
TOKYO ELECTRON LTD0 citations62
US11380697B2Jul 5, 2022
Raised pad formations for contacts in three-dimensional structures on microelectronic workpieces
TOKYO ELECTRON LTD0 citations62
US12432901B2Sep 30, 2025
Technologies for fabricating a vertical DRAM structure
TOKYO ELECTRON LTD0 citations61
US12506112B2Dec 23, 2025
Method for etching of metal
TOKYO ELECTRON LTD0 citations57
US12256558B2Mar 18, 2025
Technologies for fabricating a 3D memory structure
TOKYO ELECTRON LTD0 citations56
US12009430B2Jun 11, 2024
Method for gate stack formation and etching
TOKYO ELECTRON LTD0 citations50
CERAGEM CO LTD
5 patentsUS11890248B2Feb 6, 2024
Thermotherapy device and control method therefor
CERAGEM CO LTD3 citations72
US11839486B2Dec 12, 2023
Device and method for controlling thermotherapeutic apparatus having function of measuring heart rate
CERAGEM CO LTD2 citations72
US10744065B2Aug 18, 2020
Method for controlling acupressure force and body scan in real-time
CERAGEM CO LTD1 citations56
US11998508B2Jun 4, 2024
Massager controlling apparatus and method thereof
CERAGEM CO LTD0 citations51
US11759349B2Sep 19, 2023
Ceramic lifting and lowering device for thermotherapeutic apparatus
CERAGEM CO LTD0 citations44
SAMSUNG ELECTRONICS CO LTD
4 patentsUS7598168B2Oct 6, 2009
Method of fabricating dual damascene interconnection and etchant for stripping sacrificial layer
SAMSUNG ELECTRONICS CO LTD9 citations84
US7166019B2Jan 23, 2007
Flexible membrane for a polishing head and chemical mechanical polishing (CMP) apparatus having the same
SAMSUNG ELECTRONICS CO LTD14 citations82
US7365021B2Apr 29, 2008
Methods of fabricating a semiconductor device using an organic compound and fluoride-based buffered solution
SAMSUNG ELECTRONICS CO LTD10 citations80
US7351635B2Apr 1, 2008
Method of fabricating microelectronic device using super critical fluid
SAMSUNG ELECTRONICS CO LTD8 citations73
GLOBALFOUNDRIES INC
3 patentsUS9123771B2Sep 1, 2015
Shallow trench isolation integration methods and devices formed thereby
GLOBALFOUNDRIES INC13 citations82
US8835328B2Sep 16, 2014
Methods for fabricating integrated circuits with improved semiconductor fin structures
GLOBALFOUNDRIES INC6 citations72
US9385192B2Jul 5, 2016
Shallow trench isolation integration methods and devices formed thereby
GLOBALFOUNDRIES INC3 citations71