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Inventor
MANDLOI NEELIMA
US
2 patents
Patents
2 patents
US9977325B2
May 22, 2018
Modifying design layer of integrated circuit (IC)
IBM
2 citations
67
US10254642B2
Apr 9, 2019
Modifying design layer of integrated circuit (IC) using nested and non-nested fill objects
IBM
1 citations
56