Inventor
WANG HONGHUI
CN22 patents
⚠️ This page may combine multiple inventors who share the name “WANG HONGHUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
(unassigned)
4 patentsUS5796003AAug 18, 1998
Acoustic imaging systems
22 citations89
US6321023B1Nov 20, 2001
Serial imager for birefringent detector acoustic imaging systems
2 citations59
US6628451B2Sep 30, 2003
Acousto-optic reflection-active imaging
1 citations51
US6741382B1May 25, 2004
Acousto-optic activity for acoustic imaging
1 citations43
UNIV CHENGDU TECHNOLOGY
3 patentsUS12175633B1Dec 24, 2024
Method of enhancing abnormal area of ground-penetrating radar image based on hybrid-supervised learning
UNIV CHENGDU TECHNOLOGY4 citations71
US12411048B2Sep 9, 2025
Method for locating abnormal temperature event of distributed optical fiber
UNIV CHENGDU TECHNOLOGY0 citations47
US10656292B2May 19, 2020
Water pumping and injecting multi-layered concentric sphere neutron spectrometer
UNIV CHENGDU TECHNOLOGY0 citations46
BOE TECHNOLOGY GROUP CO LTD
3 patentsUS10720450B2Jul 21, 2020
Array substrate and manufacturing method thereof, display panel and display device
BOE TECHNOLOGY GROUP CO LTD1 citations62
US9140947B2Sep 22, 2015
Array substrate, method for repairing the same and display apparatus
BOE TECHNOLOGY GROUP CO LTD2 citations58
US9891264B2Feb 13, 2018
Line detecting apparatus and method for array substrate
BOE TECHNOLOGY GROUP CO LTD0 citations41
TONGFU MICROELECTRONICS CO LTD
3 patentsUS9837371B2Dec 5, 2017
Structure and method of reinforcing a conductor soldering point of semiconductor device
TONGFU MICROELECTRONICS CO LTD0 citations45
US12119308B2Oct 15, 2024
Packaging structure of semiconductor chip and formation method thereof
TONGFU MICROELECTRONICS CO LTD0 citations41
US10741499B2Aug 11, 2020
System-level packaging structures
TONGFU MICROELECTRONICS CO LTD0 citations40