Inventor · disambiguated record
Matti Mantysalo
Also filed as: MANTYSALO MATTI · MÄNTYSALO Matti
3 granted patents·4 pending applications·0 citations·filing 2007–2018
43Inventor score
Top patents by PatentIndex Score
7 records- 0153US10322927B2Microelectromechanical device and method for manufacturing itMURATA MANUFACTURING CO·Filed 2018·Granted Jun 18, 2019·0 cites·10 claims
- 0250US9969607B2Microelectromechanical device and method for manufacturing itMURATA MANUFACTURING CO·Filed 2016·Granted May 15, 2018·0 cites·10 claims
- 0333US10856410B2Stretchable structure comprising a conductive path and a method for manufacturing the structureTAMPERE UNIV FOUNDATION SR·Filed 2017·Granted Dec 1, 2020·0 cites·29 claims
- 0432US2008186690A1Electronics Package And Manufacturing Method ThereofNOKIA CORP·Filed 2007·Application pending·0 cites
- 0531US2008169574A1Direct Die AttachmentNOKIA CORP·Filed 2007·Application pending·0 cites
- 0631US2008176359A1Method For Manufacturing Of Electronics PackageNOKIA CORP·Filed 2007·Application pending·0 cites
- 0731US2008171450A1Wafer Bump Manufacturing Using Conductive InkNOKIA CORP·Filed 2007·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →