Inventor
REISMAN ARNOLD
36 patents
⚠️ This page may combine multiple inventors who share the name “REISMAN ARNOLD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
19 patentsUS4007464AFeb 8, 1977
Ink jet nozzle
IBM157 citations96
US4592628AJun 3, 1986
Mirror array light valve
IBM147 citations95
US4329706AMay 11, 1982
Doped polysilicon silicide semiconductor integrated circuit interconnections
IBM121 citations95
US4323589AApr 6, 1982
Plasma oxidation
IBM54 citations94
US4364166ADec 21, 1982
Semiconductor integrated circuit interconnections
IBM29 citations92
US3974769AAug 17, 1976
Method and apparatus for recording information on a recording surface through the use of mists
IBM39 citations92
US3964942AJun 22, 1976
Chemical polishing of single crystal dielectrics
IBM38 citations92
US4449580AMay 22, 1984
Vertical wall elevated pressure heat dissipation system
IBM51 citations91
US4232057ANov 4, 1980
Semiconductor plasma oxidation
IBM51 citations91
US4351805ASep 28, 1982
Single gas flow elevated pressure reactor
IBM20 citations81
US4187140AFeb 5, 1980
Method for etching silicon and a residue and oxidation resistant etchant therefor
IBM22 citations81
US4155866AMay 22, 1979
Method of controlling silicon wafer etching rates-utilizing a diazine catalyzed etchant
IBM28 citations81
US4018490AApr 19, 1977
Gas discharge display panel fabrication
IBM29 citations81
US4106975AAug 15, 1978
Process for etching holes
IBM26 citations79
US4316209AFeb 16, 1982
Metal/silicon contact and methods of fabrication thereof
IBM19 citations78
US4123571AOct 31, 1978
Method for forming smooth self limiting and pin hole free SiC films on Si
IBM25 citations77
US3961114AJun 1, 1976
Glass composition
IBM11 citations73
US4011060AMar 8, 1977
Method of controlling the softening point of solder glass
IBM6 citations58
US4065840AJan 3, 1978
Method for fabricating a DSDT target
IBM0 citations38
MCNC
10 patentsUS5325265AJun 28, 1994
High performance integrated circuit chip package
MCNC252 citations98
US5112439AMay 12, 1992
Method for selectively depositing material on substrates
MCNC136 citations98
US5037775AAug 6, 1991
Method for selectively depositing single elemental semiconductor material on substrates
MCNC68 citations96
US5201995AApr 13, 1993
Alternating cyclic pressure modulation process for selective area deposition
MCNC44 citations92
US5168078ADec 1, 1992
Method of making high density semiconductor structure
MCNC48 citations92
US5039625AAug 13, 1991
Maximum areal density recessed oxide isolation (MADROX) process
MCNC33 citations88
US5098494AMar 24, 1992
Bonding of ceramic parts
MCNC17 citations74
US5025304AJun 18, 1991
High density semiconductor structure and method of making the same
MCNC13 citations74
US5145714ASep 8, 1992
Metal-organic chemical vapor deposition for repairing broken lines in microelectronic packages
MCNC18 citations73
US5009360AApr 23, 1991
Metal-to-metal bonding method and resulting structure
MCNC4 citations63
MICROELECTRONICS CENTER OF NOR
4 patentsUS4774630ASep 27, 1988
Apparatus for mounting a semiconductor chip and making electrical connections thereto
MICROELECTRONICS CENTER OF NOR69 citations95
US4764644AAug 16, 1988
Microelectronics apparatus
MICROELECTRONICS CENTER OF NOR39 citations92
US4576884AMar 18, 1986
Method and apparatus for exposing photoresist by using an electron beam and controlling its voltage and charge
MICROELECTRONICS CENTER OF NOR16 citations74
US4667404AMay 26, 1987
Method of interconnecting wiring planes
MICROELECTRONICS CENTER OF NOR18 citations73