Inventor
ANDO YOSHIO
25 patents
⚠️ This page may combine multiple inventors who share the name “ANDO YOSHIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CANON KK
8 patentsUS4658299AApr 14, 1987
Image processing system
CANON KK34 citations92
US4769852ASep 6, 1988
Image processing system
CANON KK20 citations81
US4514641AApr 30, 1985
Apparatus for retrieving information
CANON KK20 citations80
US5159692AOct 27, 1992
Image file system with multiple control image transfer between first and second filing system storage
CANON KK10 citations73
US4878250AOct 31, 1989
Image processing system
CANON KK8 citations73
US4453823AJun 12, 1984
Method of stopping a film
CANON KK12 citations73
US4291843ASep 29, 1981
Web winding apparatus
CANON KK10 citations73
US5073965ADec 17, 1991
Image processing system
CANON KK5 citations62
HONDA MOTOR CO LTD
5 patentsUS4224376ASep 23, 1980
Process of manufacturing a heat-resistant composite sheet
HONDA MOTOR CO LTD37 citations92
US4882002ANov 21, 1989
Process of manufacturing a composite panel for shock absorption
HONDA MOTOR CO LTD9 citations73
US4601652AJul 22, 1986
Apparatus for producing a molded skin product
HONDA MOTOR CO LTD12 citations71
US4552715ANov 12, 1985
Process for producing a molded skin product
HONDA MOTOR CO LTD15 citations71
US4725034AFeb 16, 1988
Forming mold apparatus
HONDA MOTOR CO LTD4 citations57
TORAY INDUSTRIES
2 patentsUS6303219B1Oct 16, 2001
Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backed tape for wire-bonding connection, semiconductor connecting substrate, and semiconductor device
TORAY INDUSTRIES71 citations94
US6716529B2Apr 6, 2004
Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, adhesive-backed tape for wire bonding connection, semiconductor connecting substrate and semiconductor device
TORAY INDUSTRIES13 citations82