Inventor

WANG DAVID N

28 patents

⚠️ This page may combine multiple inventors who share the name “WANG DAVID N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG DAVID N

APPLIED MATERIALS INC

Plasma-enhanced CVD process using TEOS for depositing silicon oxide

Apparatus for removing deposits from backside and end edge of semiconductor wafer while preventing removal of materials from front surface of wafer

Process for CVD deposition of tungsten layer on semiconductor wafer

Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process

Multistep planarized chemical vapor deposition process with the use of low melting inorganic material for flowing while depositing

Process for PECVD of silicon oxide using TEOS decomposition

CVD of silicon oxide using TEOS decomposition and in-situ planarization process

Apparatus and method for magnetron-enhanced plasma-assisted chemical vapor deposition

Multichamber integrated process system

Magnetic field-enhanced plasma etch reactor

Process for selective deposition of tungsten on semiconductor wafer

Multi-chamber integrated process system

Magnetic field-enhanced plasma etch reactor

Two step process for forming void-free oxide layer over stepped surface of semiconductor wafer

Method for planarizing an integrated circuit structure using low melting inorganic material

Process for removing deposits from backside and end edge of semiconductor wafer while preventing removal of materials from front surface of wafer

Materials and methods for plasma etching of aluminum and aluminum alloys

Materials and methods for plasma etching of oxides and nitrides of silicon

Method for planarizing an integrated circuit structure using low melting inorganic material and flowing while depositing

In-situ photoresist capping process for plasma etching

Materials and methods for etching silicides, polycrystalline silicon and polycides

Materials and methods for etching silicides, polycrystalline silicon and polycides

Method for planarizing an integrated circuit structure using low melting inorganic material and flowing while depositing

BELL TELEPHONE LABOR INC

Plasma etching of silicon

Device fabrication by plasma etching

Reactive sputter etching of polysilicon utilizing a chlorine etch gas

High-selectivity plasma-assisted etching of resist-masked layer

Radiation mask structure