Inventor
ASANO EIICHI
JP26 patents
⚠️ This page may combine multiple inventors who share the name “ASANO EIICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINETSU CHEMICAL CO
19 patentsUS5940688AAug 17, 1999
Epoxy resin composition and semiconductor device encapsulated therewith
SHINETSU CHEMICAL CO57 citations96
US6630745B1Oct 7, 2003
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO18 citations92
US6177489B1Jan 23, 2001
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO53 citations92
US6162878ADec 19, 2000
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO21 citations92
US6001901ADec 14, 1999
Epoxy resin composition
SHINETSU CHEMICAL CO28 citations92
US5739187AApr 14, 1998
Semiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewith
SHINETSU CHEMICAL CO30 citations92
US5175199ADec 29, 1992
High transparency silica-titania glass beads, method for making, and light transmission epoxy resin compositions
SHINETSU CHEMICAL CO47 citations92
US7095125B2Aug 22, 2006
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO15 citations84
US6297306B1Oct 2, 2001
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO15 citations84
US6518332B2Feb 11, 2003
Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith
SHINETSU CHEMICAL CO9 citations74
US6723452B2Apr 20, 2004
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO9 citations72
US7943706B2May 17, 2011
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO4 citations63
US7432603B2Oct 7, 2008
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO3 citations63
US6291556B1Sep 18, 2001
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO5 citations63
US6794058B2Sep 21, 2004
Flip-chip type semiconductor device
SHINETSU CHEMICAL CO4 citations62
US6627328B2Sep 30, 2003
Light-transmissive epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO5 citations62
US6027812AFeb 22, 2000
Encapsulant of crystalline epoxy resin and phenolic resin-crystalline epoxy resin reaction product
SHINETSU CHEMICAL CO3 citations62
US6894091B2May 17, 2005
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO1 citations52
US8048969B2Nov 1, 2011
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO0 citations42
KOMATSU DENSHI KINZOKU KK
3 patentsUS5990022ANov 23, 1999
Method of evaluating a silicon wafer
KOMATSU DENSHI KINZOKU KK12 citations72
US5904568AMay 18, 1999
Method of manufacturing a semiconductor wafer
KOMATSU DENSHI KINZOKU KK5 citations61
US5897327AApr 27, 1999
Method of evaluating a semiconductor wafer
KOMATSU DENSHI KINZOKU KK3 citations61