Inventor

LIU KUO-JU

TW2 patents

⚠️ This page may combine multiple inventors who share the name “LIU KUO-JU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WINBOND ELECTRONICS CORP

1 patent

US6638849B2Oct 28, 2003

Method for manufacturing semiconductor devices having copper interconnect and low-K dielectric layer

WINBOND ELECTRONICS CORP14 citations78

SKY TECH INC

1 patent

US12224159B1Feb 11, 2025

Gas mixing method to enhance plasma

SKY TECH INC0 citations44