Inventor

DOAN TRUNG T

US228 patents

⚠️ This page may combine multiple inventors who share the name “DOAN TRUNG T”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DOAN TRUNG T

MICRON TECHNOLOGY INC

Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces

Atomic layer doping apparatus and method

Controllable ovonic phase-change semiconductor memory device and methods of fabricating the same

Planarization process for semiconductor substrates

Method of forming a container capacitor structure

Controllable ovonic phase-change semiconductor memory device and methods of fabricating the same

Chemical dispensing system for semiconductor wafer processing

Self-aligned process for making contacts to silicon substrates during the manufacture of integrated circuits therein

Multiple step method of chemical-mechanical polishing which minimizes dishing

Method for packaging semiconductor dice

Method for chemical planarization (CMP) of a semiconductor wafer to provide a planar surface free of microscratches

System and method for real-time control of semiconductor a wafer polishing, and a polishing head

Chemical-mechanical polishing techniques and methods of end point detection in chemical-mechanical polishing processes

Apparatus for planarizing semiconductor wafers, and a polishing pad for a planarization apparatus

Method to form self-aligned gate structures around cold cathode emitter tips using chemical mechanical polishing technology

Slurries for chemical mechanically polishing copper containing metal layers

Pulsed plasma enhanced CVD of metal silicide conductive films such as TiSi2

Method of providing a silicon film having a roughened outer surface

Integrated circuit polishing method

Chemical vapor deposition technique for depositing titanium silicide on semiconductor wafers

Two-step chemical mechanical polishing process for producing flush and protruding tungsten plugs

Method for planarizing semiconductor wafers with a non-circular polishing pad

Spacers for field emission display fabricated via self-aligned high energy ablation

Method to form self-aligned gate structures around cold cathode emitter tips using chemical mechanical polishing technology

Method of chemical mechanical polishing predominantly copper containing metal layers in semiconductor processing

Method to form high aspect ratio supports (spacers) for field emission display using micro-saw technology

Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer

Method to form self-aligned gate structures and focus rings

LPCVD process for depositing titanium films for semiconductor devices

Laser ablation deposition process for semiconductor manufacture

Apparatus for endpoint detection during mechanical planarization of semiconductor wafers

Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers

Method for improving step coverage of a metallization layer on an integrated circuit by use of a high melting point metal as an anti-reflective coating during laser planarization

Method of etching back of tungsten layers on semiconductor wafers, and solution therefore

Die-wafer package and method of fabricating same

Atomic layer deposition of capacitor dielectric

Self-aligned, magnetoresistive random-access memory (MRAM) structure utilizing a spacer containment scheme

Endpoint detector and method for measuring a change in wafer thickness

Method for improving CMP processing

IC mechanical planarization process incorporating two slurry compositions for faster material removal times

Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates

IC mechanical planarization process incorporating two slurry compositions for faster material removal times

IC mechanical planarization process incorporating two slurry compositions for faster material removal times

Field emission structures produced on macro-grain polysilicon substrates

Method for forming a mixed phase TiN/TiSi film for semiconductor manufacture using metal organometallic precursors and organic silane

Method for simultaneously forming silicide and effecting dopant activation on a semiconductor wafer

Method of forming a capacitor in semiconductor wafer processing

MICRON SEMICONDUCTOR INC

Method to slope conductor profile prior to dielectric deposition to improve dielectric step-coverage

Method to form a low resistant bond pad interconnect

Chemical-mechanical polishing processes of planarizing insulating layers