Inventor

SHIROYAMA TAISUKE

JP2 patents

Patents

2 patents

US6010956AJan 4, 2000

Process for producing multilayer wiring boards

TOKYO OHKA KOGYO CO LTD77 citations93

US6228465B1May 8, 2001

Process for producing multilayer wiring boards

TOKYO OHKA KOGYO CO LTD38 citations90