P

Inventor

DOKUMACI OMER H

US88 patents
⚠️ This page may combine multiple inventors who share the name “DOKUMACI OMER H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

49 patents
US7247534B2Jul 24, 2007

Silicon device on Si:C-OI and SGOI and method of manufacture

IBM95 citations99
US7198995B2Apr 3, 2007

Strained finFETs and method of manufacture

IBM154 citations99
US7041538B2May 9, 2006

Method of manufacturing a disposable reversed spacer process for high performance recessed channel CMOS

IBM124 citations99
US6977194B2Dec 20, 2005

Structure and method to improve channel mobility by gate electrode stress modification

IBM225 citations99
US6825529B2Nov 30, 2004

Stress inducing spacers

IBM234 citations99
US7682887B2Mar 23, 2010

Transistor having high mobility channel and methods

IBM152 citations98
US6974981B2Dec 13, 2005

Isolation structures for imposing stress patterns

IBM137 citations98
US7303949B2Dec 4, 2007

High performance stress-enhanced MOSFETs using Si:C and SiGe epitaxial source/drain and method of manufacture

IBM44 citations96
US7056773B2Jun 6, 2006

Backgated FinFET having different oxide thicknesses

IBM37 citations96
US6890808B2May 10, 2005

Method and structure for improved MOSFETs using poly/silicide gate height control

IBM60 citations96
US6887751B2May 3, 2005

MOSFET performance improvement using deformation in SOI structure

IBM61 citations96
US6869866B1Mar 22, 2005

Silicide proximity structures for CMOS device performance improvements

IBM53 citations96
US6780694B2Aug 24, 2004

MOS transistor

IBM67 citations96
US6657244B1Dec 2, 2003

Structure and method to reduce silicon substrate consumption and improve gate sheet resistance during silicide formation

IBM55 citations96
US7361973B2Apr 22, 2008

Embedded stressed nitride liners for CMOS performance improvement

IBM17 citations93
US7262087B2Aug 28, 2007

Dual stressed SOI substrates

IBM20 citations93
US7223994B2May 29, 2007

Strained Si on multiple materials for bulk or SOI substrates

IBM21 citations93
US7176116B2Feb 13, 2007

High performance FET with laterally thin extension

IBM17 citations93
US7144787B2Dec 5, 2006

Methods to improve the SiGe heterojunction bipolar device performance

IBM16 citations93
US7091563B2Aug 15, 2006

Method and structure for improved MOSFETs using poly/silicide gate height control

IBM16 citations93
US7037770B2May 2, 2006

Method of manufacturing strained dislocation-free channels for CMOS

IBM33 citations93
US7026247B2Apr 11, 2006

Nanocircuit and self-correcting etching method for fabricating same

IBM21 citations93
US6872641B1Mar 29, 2005

Strained silicon on relaxed sige film with uniform misfit dislocation density

IBM16 citations93
US6812105B1Nov 2, 2004

Ultra-thin channel device with raised source and drain and solid source extension doping

IBM28 citations93
US6806534B2Oct 19, 2004

Damascene method for improved MOS transistor

IBM35 citations93
US6645867B2Nov 11, 2003

Structure and method to preserve STI during etching

IBM21 citations93
US6562713B1May 13, 2003

Method of protecting semiconductor areas while exposing a gate

IBM42 citations93
US6509221B1Jan 21, 2003

Method for forming high performance CMOS devices with elevated sidewall spacers

IBM25 citations93
US7453123B2Nov 18, 2008

Self-aligned planar double-gate transistor structure

IBM15 citations92
US7374987B2May 20, 2008

Stress inducing spacers

IBM32 citations92
US7205185B2Apr 17, 2007

Self-aligned planar double-gate process by self-aligned oxidation

IBM26 citations92
US7144767B2Dec 5, 2006

NFETs using gate induced stress modulation

IBM24 citations92
US6878978B2Apr 12, 2005

CMOS performance enhancement using localized voids and extended defects

IBM15 citations92
US6833569B2Dec 21, 2004

Self-aligned planar double-gate process by amorphization

IBM24 citations92
US6709926B2Mar 23, 2004

High performance logic and high density embedded dram with borderless contact and antispacer

IBM26 citations92
US6677646B2Jan 13, 2004

Method and structure of a disposable reversed spacer process for high performance recessed channel CMOS

IBM41 citations92
US6566210B2May 20, 2003

Method of improving gate activation by employing atomic oxygen enhanced oxidation

IBM35 citations92
US6329704B1Dec 11, 2001

Ultra-shallow junction dopant layer having a peak concentration within a dielectric layer

IBM34 citations92
US7952149B2May 31, 2011

Anti-halo compensation

IBM11 citations84
US7595247B2Sep 29, 2009

Halo-first ultra-thin SOI FET for superior short channel control

IBM11 citations84
US7476914B2Jan 13, 2009

Methods to improve the SiGe heterojunction bipolar device performance

IBM8 citations84
US7312134B2Dec 25, 2007

Dual stressed SOI substrates

IBM10 citations84
US6933577B2Aug 23, 2005

High performance FET with laterally thin extension

IBM14 citations84
US6642147B2Nov 4, 2003

Method of making thermally stable planarizing films

IBM15 citations84
US6569781B1May 27, 2003

Method of forming an ultra-thin oxide layer on a silicon substrate by implantation of nitrogen through a sacrificial layer and subsequent annealing prior to oxide formation

IBM17 citations84
US6873010B2Mar 29, 2005

High performance logic and high density embedded dram with borderless contact and antispacer

IBM14 citations83
US6531365B2Mar 11, 2003

Anti-spacer structure for self-aligned independent gate implantation

IBM13 citations82
US7964865B2Jun 21, 2011

Strained silicon on relaxed sige film with uniform misfit dislocation density

IBM6 citations74
US7495291B2Feb 24, 2009

Strained dislocation-free channels for CMOS and method of manufacture

IBM6 citations74

CHIDAMBARRAO DURESETI

1 patent

Showing the top 50 of 88 patents by PatentIndex Score.