Inventor
DOKUMACI OMER H
US88 patents
⚠️ This page may combine multiple inventors who share the name “DOKUMACI OMER H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
49 patentsUS7247534B2Jul 24, 2007
Silicon device on Si:C-OI and SGOI and method of manufacture
IBM95 citations99
US7198995B2Apr 3, 2007
Strained finFETs and method of manufacture
IBM154 citations99
US7041538B2May 9, 2006
Method of manufacturing a disposable reversed spacer process for high performance recessed channel CMOS
IBM124 citations99
US6977194B2Dec 20, 2005
Structure and method to improve channel mobility by gate electrode stress modification
IBM225 citations99
US6825529B2Nov 30, 2004
Stress inducing spacers
IBM234 citations99
US7682887B2Mar 23, 2010
Transistor having high mobility channel and methods
IBM152 citations98
US6974981B2Dec 13, 2005
Isolation structures for imposing stress patterns
IBM137 citations98
US7303949B2Dec 4, 2007
High performance stress-enhanced MOSFETs using Si:C and SiGe epitaxial source/drain and method of manufacture
IBM44 citations96
US7056773B2Jun 6, 2006
Backgated FinFET having different oxide thicknesses
IBM37 citations96
US6890808B2May 10, 2005
Method and structure for improved MOSFETs using poly/silicide gate height control
IBM60 citations96
US6887751B2May 3, 2005
MOSFET performance improvement using deformation in SOI structure
IBM61 citations96
US6869866B1Mar 22, 2005
Silicide proximity structures for CMOS device performance improvements
IBM53 citations96
US6780694B2Aug 24, 2004
MOS transistor
IBM67 citations96
US6657244B1Dec 2, 2003
Structure and method to reduce silicon substrate consumption and improve gate sheet resistance during silicide formation
IBM55 citations96
US7361973B2Apr 22, 2008
Embedded stressed nitride liners for CMOS performance improvement
IBM17 citations93
US7262087B2Aug 28, 2007
Dual stressed SOI substrates
IBM20 citations93
US7223994B2May 29, 2007
Strained Si on multiple materials for bulk or SOI substrates
IBM21 citations93
US7176116B2Feb 13, 2007
High performance FET with laterally thin extension
IBM17 citations93
US7144787B2Dec 5, 2006
Methods to improve the SiGe heterojunction bipolar device performance
IBM16 citations93
US7091563B2Aug 15, 2006
Method and structure for improved MOSFETs using poly/silicide gate height control
IBM16 citations93
US7037770B2May 2, 2006
Method of manufacturing strained dislocation-free channels for CMOS
IBM33 citations93
US7026247B2Apr 11, 2006
Nanocircuit and self-correcting etching method for fabricating same
IBM21 citations93
US6872641B1Mar 29, 2005
Strained silicon on relaxed sige film with uniform misfit dislocation density
IBM16 citations93
US6812105B1Nov 2, 2004
Ultra-thin channel device with raised source and drain and solid source extension doping
IBM28 citations93
US6806534B2Oct 19, 2004
Damascene method for improved MOS transistor
IBM35 citations93
US6645867B2Nov 11, 2003
Structure and method to preserve STI during etching
IBM21 citations93
US6562713B1May 13, 2003
Method of protecting semiconductor areas while exposing a gate
IBM42 citations93
US6509221B1Jan 21, 2003
Method for forming high performance CMOS devices with elevated sidewall spacers
IBM25 citations93
US7453123B2Nov 18, 2008
Self-aligned planar double-gate transistor structure
IBM15 citations92
US7374987B2May 20, 2008
Stress inducing spacers
IBM32 citations92
US7205185B2Apr 17, 2007
Self-aligned planar double-gate process by self-aligned oxidation
IBM26 citations92
US7144767B2Dec 5, 2006
NFETs using gate induced stress modulation
IBM24 citations92
US6878978B2Apr 12, 2005
CMOS performance enhancement using localized voids and extended defects
IBM15 citations92
US6833569B2Dec 21, 2004
Self-aligned planar double-gate process by amorphization
IBM24 citations92
US6709926B2Mar 23, 2004
High performance logic and high density embedded dram with borderless contact and antispacer
IBM26 citations92
US6677646B2Jan 13, 2004
Method and structure of a disposable reversed spacer process for high performance recessed channel CMOS
IBM41 citations92
US6566210B2May 20, 2003
Method of improving gate activation by employing atomic oxygen enhanced oxidation
IBM35 citations92
US6329704B1Dec 11, 2001
Ultra-shallow junction dopant layer having a peak concentration within a dielectric layer
IBM34 citations92
US7952149B2May 31, 2011
Anti-halo compensation
IBM11 citations84
US7595247B2Sep 29, 2009
Halo-first ultra-thin SOI FET for superior short channel control
IBM11 citations84
US7476914B2Jan 13, 2009
Methods to improve the SiGe heterojunction bipolar device performance
IBM8 citations84
US7312134B2Dec 25, 2007
Dual stressed SOI substrates
IBM10 citations84
US6933577B2Aug 23, 2005
High performance FET with laterally thin extension
IBM14 citations84
US6642147B2Nov 4, 2003
Method of making thermally stable planarizing films
IBM15 citations84
US6569781B1May 27, 2003
Method of forming an ultra-thin oxide layer on a silicon substrate by implantation of nitrogen through a sacrificial layer and subsequent annealing prior to oxide formation
IBM17 citations84
US6873010B2Mar 29, 2005
High performance logic and high density embedded dram with borderless contact and antispacer
IBM14 citations83
US6531365B2Mar 11, 2003
Anti-spacer structure for self-aligned independent gate implantation
IBM13 citations82
US7964865B2Jun 21, 2011
Strained silicon on relaxed sige film with uniform misfit dislocation density
IBM6 citations74
US7495291B2Feb 24, 2009
Strained dislocation-free channels for CMOS and method of manufacture
IBM6 citations74
CHIDAMBARRAO DURESETI
1 patentShowing the top 50 of 88 patents by PatentIndex Score.