Inventor
BERMAN MICHAEL J
US55 patents
⚠️ This page may combine multiple inventors who share the name “BERMAN MICHAEL J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
34 patentsUS6273798B1Aug 14, 2001
Pre-conditioning polishing pads for chemical-mechanical polishing
LSI LOGIC CORP91 citations98
US5882251AMar 16, 1999
Chemical mechanical polishing pad slurry distribution grooves
LSI LOGIC CORP144 citations98
US5893756AApr 13, 1999
Use of ethylene glycol as a corrosion inhibitor during cleaning after metal chemical mechanical polishing
LSI LOGIC CORP127 citations97
US6837967B1Jan 4, 2005
Method and apparatus for cleaning deposited films from the edge of a wafer
LSI LOGIC CORP107 citations96
US5957757ASep 28, 1999
Conditioning CMP polishing pad using a high pressure fluid
LSI LOGIC CORP85 citations96
US6898064B1May 24, 2005
System and method for optimizing the electrostatic removal of a workpiece from a chuck
LSI LOGIC CORP63 citations94
US7751609B1Jul 6, 2010
Determination of film thickness during chemical mechanical polishing
LSI LOGIC CORP37 citations93
US6722948B1Apr 20, 2004
Pad conditioning monitor
LSI LOGIC CORP43 citations93
US6375550B1Apr 23, 2002
Method and apparatus for enhancing uniformity during polishing of a semiconductor wafer
LSI LOGIC CORP24 citations93
US5990010ANov 23, 1999
Pre-conditioning polishing pads for chemical-mechanical polishing
LSI LOGIC CORP40 citations93
US5985679ANov 16, 1999
Automated endpoint detection system during chemical-mechanical polishing
LSI LOGIC CORP39 citations93
US7332062B1Feb 19, 2008
Electroplating tool for semiconductor manufacture having electric field control
LSI LOGIC CORP23 citations92
US6982206B1Jan 3, 2006
Mechanism for improving the structural integrity of low-k films
LSI LOGIC CORP20 citations92
US6894762B1May 17, 2005
Dual source lithography for direct write application
LSI LOGIC CORP24 citations92
US6885436B1Apr 26, 2005
Optical error minimization in a semiconductor manufacturing apparatus
LSI LOGIC CORP17 citations92
US6739953B1May 25, 2004
Mechanical stress free processing method
LSI LOGIC CORP37 citations92
US6849936B1Feb 1, 2005
System and method for using film deposition techniques to provide an antenna within an integrated circuit package
LSI LOGIC CORP40 citations91
US5835226ANov 10, 1998
Method for determining optical constants prior to film processing to be used improve accuracy of post-processing thickness measurements
LSI LOGIC CORP52 citations90
US6743979B1Jun 1, 2004
Bonding pad isolation
LSI LOGIC CORP16 citations84
US6234883B1May 22, 2001
Method and apparatus for concurrent pad conditioning and wafer buff in chemical mechanical polishing
LSI LOGIC CORP16 citations82
US6347291B1Feb 12, 2002
Substrate position location system
LSI LOGIC CORP11 citations74
US6108093AAug 22, 2000
Automated inspection system for residual metal after chemical-mechanical polishing
LSI LOGIC CORP13 citations74
US6069085AMay 30, 2000
Slurry filling a recess formed during semiconductor fabrication
LSI LOGIC CORP8 citations74
US7023530B1Apr 4, 2006
Dual source lithography for direct write application
LSI LOGIC CORP5 citations73
US6627466B1Sep 30, 2003
Method and apparatus for detecting backside contamination during fabrication of a semiconductor wafer
LSI LOGIC CORP6 citations72
US6297558B1Oct 2, 2001
Slurry filling a recess formed during semiconductor fabrication
LSI LOGIC CORP2 citations63
US7098996B1Aug 29, 2006
Optical error minimization in a semiconductor manufacturing apparatus
LSI LOGIC CORP2 citations62
US6971944B2Dec 6, 2005
Method and control system for improving CMP process by detecting and reacting to harmonic oscillation
LSI LOGIC CORP3 citations62
US6464566B1Oct 15, 2002
Apparatus and method for linearly planarizing a surface of a semiconductor wafer
LSI LOGIC CORP2 citations62
US7081037B2Jul 25, 2006
Pad conditioner setup
LSI LOGIC CORP2 citations61
US6831022B1Dec 14, 2004
Method and apparatus for removing water vapor as a byproduct of chemical reaction in a wafer processing chamber
LSI LOGIC CORP3 citations58
US6630411B1Oct 7, 2003
Method and apparatus for removing water vapor as a byproduct of chemical reaction in a wafer processing chamber
LSI LOGIC CORP2 citations58
US7183787B2Feb 27, 2007
Contact resistance device for improved process control
LSI LOGIC CORP0 citations52
US6979251B2Dec 27, 2005
Method and apparatus to add slurry to a polishing system
LSI LOGIC CORP0 citations52
LSI CORP
3 patentsFRAGRANCE TECHNOLOGY TRUST
2 patentsTEMPRONICS INC
2 patentsRETAIL COMM CORP
2 patentsRETAIL COMMUNICATIONS CORP
2 patentsAKI INC
1 patentWEBER ORTHOPEDIC INC
1 patentMAKANSI TAREK
1 patentPRATHER ZACHARY A
1 patentGEN INSTRUMENT CORP
1 patentShowing the top 50 of 55 patents by PatentIndex Score.