Inventor · disambiguated record
Ravindhar K. Kaw
Also filed as: KAW RAVINDHAR · KAW RAVINDHAR K
5 granted patents·96 citations·filing 1988–2003
79Inventor score
Top patents by PatentIndex Score
5 records- 0181US5065280AFlex interconnect moduleHEWLETT PACKARD CO·Filed 1990·Granted Nov 12, 1991·72 cites·7 claims
- 0270US6738583B1Self-aligning infra-red communication linkAGILENT TECHNOLOGIES INC·Filed 2000·Granted May 18, 2004·12 cites·3 claims
- 0351US7262508B2Integrated circuit incorporating flip chip and wire bondingAVAGO TECHNOLOGIES GENERAL IP·Filed 2003·Granted Aug 28, 2007·5 cites·11 claims
- 0442US7202546B2Integrated circuit with copper interconnect and top level bonding/interconnect layerAVAGO TECHNOLOGIES GENERAL IP·Filed 2003·Granted Apr 10, 2007·1 cites·22 claims
- 0531US5021869AMonolithic semiconductor chip interconnection technique and arrangementHEWLETT PACKARD CO·Filed 1988·Granted Jun 4, 1991·6 cites·4 claims
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