Inventor
WEIDMAN TIMOTHY
US37 patents
⚠️ This page may combine multiple inventors who share the name “WEIDMAN TIMOTHY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
23 patentsUS6583071B1Jun 24, 2003
Ultrasonic spray coating of liquid precursor for low K dielectric coatings
APPLIED MATERIALS INC146 citations99
US6573030B1Jun 3, 2003
Method for depositing an amorphous carbon layer
APPLIED MATERIALS INC1,317 citations98
US6841341B2Jan 11, 2005
Method of depositing an amorphous carbon layer
APPLIED MATERIALS INC78 citations97
US7223526B2May 29, 2007
Method of depositing an amorphous carbon layer
APPLIED MATERIALS INC50 citations96
US6936551B2Aug 30, 2005
Methods and apparatus for E-beam treatment used to fabricate integrated circuit devices
APPLIED MATERIALS INC52 citations96
US6875687B1Apr 5, 2005
Capping layer for extreme low dielectric constant films
APPLIED MATERIALS INC113 citations96
US6780753B2Aug 24, 2004
Airgap for semiconductor devices
APPLIED MATERIALS INC126 citations96
US5885751AMar 23, 1999
Method and apparatus for depositing deep UV photoresist films
APPLIED MATERIALS INC46 citations96
US7256139B2Aug 14, 2007
Methods and apparatus for e-beam treatment used to fabricate integrated circuit devices
APPLIED MATERIALS INC46 citations94
US7335462B2Feb 26, 2008
Method of depositing an amorphous carbon layer
APPLIED MATERIALS INC24 citations92
US7226853B2Jun 5, 2007
Method of forming a dual damascene structure utilizing a three layer hard mask structure
APPLIED MATERIALS INC51 citations92
US6806203B2Oct 19, 2004
Method of forming a dual damascene structure using an amorphous silicon hard mask
APPLIED MATERIALS INC43 citations91
US6576568B2Jun 10, 2003
Ionic additives for extreme low dielectric constant chemical formulations
APPLIED MATERIALS INC29 citations91
US6896955B2May 24, 2005
Ionic additives for extreme low dielectric constant chemical formulations
APPLIED MATERIALS INC16 citations90
US7547569B2Jun 16, 2009
Method for patterning Mo layer in a photovoltaic device comprising CIGS material using an etch process
APPLIED MATERIALS INC8 citations84
US7273813B2Sep 25, 2007
Wafer cleaning solution for cobalt electroless application
APPLIED MATERIALS INC11 citations84
US7431585B2Oct 7, 2008
Apparatus and method for heating substrates
APPLIED MATERIALS INC14 citations83
US7381052B2Jun 3, 2008
Apparatus and method for heating substrates
APPLIED MATERIALS INC14 citations83
US6090530AJul 18, 2000
Method and apparatus for depositing deep UV photoresist films
APPLIED MATERIALS INC15 citations82
US6238844B1May 29, 2001
Process for depositing a plasma polymerized organosilicon photoresist film
APPLIED MATERIALS INC11 citations73
US6989227B2Jan 24, 2006
E-beam curable resist and process for e-beam curing the resist
APPLIED MATERIALS INC6 citations63
US7910476B2Mar 22, 2011
Adhesion and minimizing oxidation on electroless CO alloy films for integration with low K inter-metal dielectric and etch stop
APPLIED MATERIALS INC3 citations62
US7601264B2Oct 13, 2009
Method for treatment of plating solutions
APPLIED MATERIALS INC3 citations58
SUNPOWER CORP
4 patentsUS10224442B2Mar 5, 2019
Metallization of solar cells with differentiated P-type and N-type region architectures
SUNPOWER CORP2 citations73
US9401450B2Jul 26, 2016
Solar cell emitter region fabrication using ion implantation
SUNPOWER CORP4 citations73
US11437530B2Sep 6, 2022
Metallization of solar cells with differentiated p-type and n-type region architectures
SUNPOWER CORP0 citations62
US11316056B2Apr 26, 2022
Solar cell emitter region fabrication using self-aligned implant and cap
SUNPOWER CORP0 citations62
SMITH DAVID D
3 patentsUS9263625B2Feb 16, 2016
Solar cell emitter region fabrication using ion implantation
SMITH DAVID D20 citations92
US9502601B1Nov 22, 2016
Metallization of solar cells with differentiated P-type and N-type region architectures
SMITH DAVID D11 citations83
US9577126B2Feb 21, 2017
Solar cell emitter region fabrication using ion implantation
SMITH DAVID D0 citations52