Inventor
HOLMES JOHN
US37 patents
⚠️ This page may combine multiple inventors who share the name “HOLMES JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RESEARCH IN MOTION LTD
6 patentsUS7489301B2Feb 10, 2009
Split Keyboard
RESEARCH IN MOTION LTD22 citations93
US7130185B2Oct 31, 2006
Handheld computing device having drop-resistant LCD display
RESEARCH IN MOTION LTD23 citations92
US7409058B2Aug 5, 2008
Display cover for a communication device
RESEARCH IN MOTION LTD16 citations91
US7551430B2Jun 23, 2009
Handheld computing device having drop-resistant LCD display
RESEARCH IN MOTION LTD8 citations84
US7991148B2Aug 2, 2011
Display cover and case for a communication device
RESEARCH IN MOTION LTD4 citations61
US7027295B2Apr 11, 2006
Compact design for handheld computing device having LCD display
RESEARCH IN MOTION LTD2 citations60
BOSTON SCIENT CORP
4 patentsUS6096009AAug 1, 2000
Guidewire and catheter locking device and method
BOSTON SCIENT CORP191 citations98
US7670316B2Mar 2, 2010
Guidewire and catheter locking device and method
BOSTON SCIENT CORP36 citations95
US7060052B2Jun 13, 2006
Guidewire and catheter locking device and method
BOSTON SCIENT CORP42 citations95
US6663597B1Dec 16, 2003
Guidewire and catheter locking device and method
BOSTON SCIENT CORP53 citations95
MICROSOFT CORP
4 patentsUS7363378B2Apr 22, 2008
Transport system for instant messaging
MICROSOFT CORP45 citations92
US7333517B2Feb 19, 2008
Method and system for accurately calculating latency variation on an end-to-end path in a network
MICROSOFT CORP34 citations92
US6975656B1Dec 13, 2005
Method and system for accurately calculating latency variation on an end-to-end path in a network
MICROSOFT CORP22 citations92
US7539727B2May 26, 2009
Instant messaging object store
MICROSOFT CORP16 citations83
QUALCOMM INC
4 patentsUS10002857B2Jun 19, 2018
Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layer
QUALCOMM INC10 citations79
US11417622B2Aug 16, 2022
Flip-chip device
QUALCOMM INC0 citations62
US11404343B2Aug 2, 2022
Package comprising a substrate configured as a heat spreader
QUALCOMM INC1 citations58
US12512412B2Dec 30, 2025
Substrate with multiple core layers to provide varied thickness cavities supporting varied thickness embedded electrical devices, and related integrated circuit (IC) packages and fabrication methods
QUALCOMM INC0 citations52