Inventor
LEE JIUN-CHUNG
TW3 patents
Patents
3 patentsUS5956609ASep 21, 1999
Method for reducing stress and improving step-coverage of tungsten interconnects and plugs
TAIWAN SEMICONDUCTOR MFG106 citations95
US6179691B1Jan 30, 2001
Method for endpoint detection for copper CMP
TAIWAN SEMICONDUCTOR MFG21 citations90
US6503124B1Jan 7, 2003
Method for endpoint detection for copper CMP
TAIWAN SEMICONDUCTOR MFG2 citations60