Inventor
CHO TAI-HEUI
KR6 patents
Patents
6 patentsUS6984895B2Jan 10, 2006
Bonding pad structure of a semiconductor device
SAMSUNG ELECTRONICS CO LTD15 citations82
US7180154B2Feb 20, 2007
Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD15 citations77
US6806574B2Oct 19, 2004
Semiconductor device having multilevel interconnections and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD8 citations71
US7074712B2Jul 11, 2006
Semiconductor device having multilevel interconnections and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations60
US6867070B2Mar 15, 2005
Bonding pad structure of a semiconductor device and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations60
US7556989B2Jul 7, 2009
Semiconductor device having fuse pattern and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD3 citations57