Inventor
OKUZAWA NOBUYUKI
JP26 patents
⚠️ This page may combine multiple inventors who share the name “OKUZAWA NOBUYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TDK CORP
15 patentsUS8050045B2Nov 1, 2011
Electronic component and method of manufacturing the same
TDK CORP42 citations92
US7557439B1Jul 7, 2009
Layered chip package that implements memory device
TDK CORP31 citations92
US7145427B2Dec 5, 2006
Coil component and method of manufacturing the same
TDK CORP25 citations92
US7221250B2May 22, 2007
Coil component and method of manufacturing the same
TDK CORP23 citations91
US7414508B2Aug 19, 2008
Common mode choke coil and method of manufacturing the same
TDK CORP12 citations84
US7318269B2Jan 15, 2008
Method of manufacturing coil component
TDK CORP15 citations84
US7397334B2Jul 8, 2008
Coil component and method of manufacturing the same
TDK CORP14 citations83
US11508494B2Nov 22, 2022
Dielectric composition and electronic component
TDK CORP0 citations62
US7905008B2Mar 15, 2011
Method of manufacturing a coil component
TDK CORP5 citations62
US7283028B2Oct 16, 2007
Coil component
TDK CORP5 citations62
US11380482B2Jul 5, 2022
Dielectric composition and electronic component
TDK CORP0 citations59
US12462970B2Nov 4, 2025
Coil component
TDK CORP0 citations50
US12293864B2May 6, 2025
Coil component and manufacturing method therefor
TDK CORP0 citations50
US12170163B2Dec 17, 2024
Coil component and manufacturing method therefor
TDK CORP0 citations50
US7683269B2Mar 23, 2010
Thin film device and method for manufacturing the same
TDK CORP1 citations50
HEADWAY TECHNOLOGIES INC
7 patentsUS7863095B2Jan 4, 2011
Method of manufacturing layered chip package
HEADWAY TECHNOLOGIES INC233 citations99
US7968374B2Jun 28, 2011
Layered chip package with wiring on the side surfaces
HEADWAY TECHNOLOGIES INC17 citations92
US7767494B2Aug 3, 2010
Method of manufacturing layered chip package
HEADWAY TECHNOLOGIES INC24 citations92
US7745259B2Jun 29, 2010
Layered chip package and method of manufacturing same
HEADWAY TECHNOLOGIES INC24 citations92
US7964976B2Jun 21, 2011
Layered chip package and method of manufacturing same
HEADWAY TECHNOLOGIES INC8 citations84
US7868442B2Jan 11, 2011
Layered chip package and method of manufacturing same
HEADWAY TECHNOLOGIES INC10 citations84
US7846772B2Dec 7, 2010
Layered chip package and method of manufacturing same
HEADWAY TECHNOLOGIES INC6 citations74
SASAKI YOSHITAKA
4 patentsUS8154116B2Apr 10, 2012
Layered chip package with heat sink
SASAKI YOSHITAKA11 citations84
US8134229B2Mar 13, 2012
Layered chip package
SASAKI YOSHITAKA5 citations63
US8324741B2Dec 4, 2012
Layered chip package with wiring on the side surfaces
SASAKI YOSHITAKA3 citations62
US8513034B2Aug 20, 2013
Method of manufacturing layered chip package
SASAKI YOSHITAKA0 citations52