Inventor
GIRI AJAY P
US19 patents
⚠️ This page may combine multiple inventors who share the name “GIRI AJAY P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
18 patentsUS5931222AAug 3, 1999
Adhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using same
IBM150 citations99
US6281452B1Aug 28, 2001
Multi-level thin-film electronic packaging structure and related method
IBM53 citations95
US6037044AMar 14, 2000
Direct deposit thin film single/multi chip module
IBM68 citations95
US6678949B2Jan 20, 2004
Process for forming a multi-level thin-film electronic packaging structure
IBM21 citations92
US6451155B1Sep 17, 2002
Method using a thin adhesion promoting layer for bonding silicone elastomeric material to nickel and use thereof in making a heat sink assembly
IBM31 citations92
US6291272B1Sep 18, 2001
Structure and process for making substrate packages for high frequency application
IBM33 citations92
US6261467B1Jul 17, 2001
Direct deposit thin film single/multi chip module
IBM26 citations91
US5135595AAug 4, 1992
Process for fabricating a low dielectric composite substrate
IBM24 citations91
US5912044AJun 15, 1999
Method for forming thin film capacitors
IBM54 citations88
US8003512B2Aug 23, 2011
Structure of UBM and solder bumps and methods of fabrication
IBM19 citations81
US5277725AJan 11, 1994
Process for fabricating a low dielectric composite substrate
IBM17 citations81
US6896784B2May 24, 2005
Method for controlling local current to achieve uniform plating thickness
IBM8 citations71
US6890413B2May 10, 2005
Method and apparatus for controlling local current to achieve uniform plating thickness
IBM6 citations71
US5370974ADec 6, 1994
Laser exposure of photosensitive polyimide for pattern formation
IBM11 citations68
US6235412B1May 22, 2001
Corrosion-resistant terminal metal pads for thin film packages
IBM4 citations62
US6083375AJul 4, 2000
Process for producing corrosion-resistant terminal metal pads for thin film packages
IBM5 citations62
US5270151ADec 14, 1993
Spin on oxygen reactive ion etch barrier
IBM6 citations62
US7932169B2Apr 26, 2011
Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers
IBM1 citations51