Inventor
SHEN MINGHAO
US24 patents
⚠️ This page may combine multiple inventors who share the name “SHEN MINGHAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SPANSION LLC
10 patentsUS7368347B2May 6, 2008
Dual bit flash memory devices and methods for fabricating the same
SPANSION LLC18 citations92
US7732281B1Jun 8, 2010
Methods for fabricating dual bit flash memory devices
SPANSION LLC8 citations84
US7635627B2Dec 22, 2009
Methods for fabricating a memory device including a dual bit memory cell
SPANSION LLC4 citations63
US7829936B2Nov 9, 2010
Split charge storage node inner spacer process
SPANSION LLC2 citations62
US8039891B2Oct 18, 2011
Split charge storage node outer spacer process
SPANSION LLC0 citations52
US8012830B2Sep 6, 2011
ORO and ORPRO with bit line trench to suppress transport program disturb
SPANSION LLC0 citations52
US7883963B2Feb 8, 2011
Split charge storage node outer spacer process
SPANSION LLC0 citations52
US7687360B2Mar 30, 2010
Method of forming spaced-apart charge trapping stacks
SPANSION LLC1 citations52
US7705390B2Apr 27, 2010
Dual bit flash memory devices and methods for fabricating the same
SPANSION LLC0 citations51
US7867848B2Jan 11, 2011
Methods for fabricating dual bit flash memory devices
SPANSION LLC0 citations48
DIDREW TECH BVI LIMITED
6 patentsUS10347509B1Jul 9, 2019
Molded cavity fanout package without using a carrier and method of manufacturing the same
DIDREW TECH BVI LIMITED12 citations83
US10209542B1Feb 19, 2019
System and method of embedding driver IC (EmDIC) in LCD display substrate
DIDREW TECH BVI LIMITED7 citations83
US12199025B2Jan 14, 2025
Interposer structure containing embedded silicon-less link chiplet
DIDREW TECH BVI LIMITED2 citations73
US10424524B2Sep 24, 2019
Multiple wafers fabrication technique on large carrier with warpage control stiffener
DIDREW TECH BVI LIMITED6 citations71
US10209597B1Feb 19, 2019
System and method of manufacturing frameless LCD display
DIDREW TECH BVI LIMITED5 citations67
US10734326B2Aug 4, 2020
Hermetic flat top integrated heat spreader (IHS)/electromagnetic interference (EMI) shield package and method of manufacturing thereof for reducing warpage
DIDREW TECH BVI LIMITED0 citations39
ALTERA CORP
4 patentsUS9806061B2Oct 31, 2017
Bumpless wafer level fan-out package
ALTERA CORP10 citations83
US9425125B2Aug 23, 2016
Silicon-glass hybrid interposer circuitry
ALTERA CORP11 citations83
US9385060B1Jul 5, 2016
Integrated circuit package with enhanced thermal conduction
ALTERA CORP12 citations83
US9842820B1Dec 12, 2017
Wafer-level fan-out wirebond packages
ALTERA CORP5 citations72
CHENGDU ESWIN SIP TECH CO LTD
2 patentsUS11274234B2Mar 15, 2022
Adhesive composition for temporary bonding of semiconductor workpiece and support carrier pair
CHENGDU ESWIN SIP TECH CO LTD5 citations66
US11488931B2Nov 1, 2022
Encapsulated fan-in semiconductor package with heat spreader and method of manufacturing the same
CHENGDU ESWIN SIP TECH CO LTD0 citations48