Inventor

USENKO ALEX

US18 patents

⚠️ This page may combine multiple inventors who share the name “USENKO ALEX”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

USENKO ALEX

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor-on-insulator (SOI) substrate comprising a trap-rich layer with small grain sizes

Methods of forming SOI substrates

Methods of forming SOI substrates

Methods of forming SOI substrates

CORNING INC

Semiconductor on glass substrate with stiffening layer and process of making the same

Methods and apparatus for producing semiconductor on insulator structures using directed exfoliation

Methods and apparatus for producing semiconductor on insulator structures using directed exfoliation

SUNEDISON SEMICONDUCTOR LTD UEN201334164H

High resistivity semiconductor-on-insulator wafer and a method of manufacturing

Thermally stable charge trapping layer for use in manufacture of semiconductor-on-insulator structures

Handle substrate for use in manufacture of semiconductor-on-insulator structure and method of manufacturing thereof

GLOBALWAFERS CO LTD

High resistivity semiconductor-on-insulator wafer and a method of manufacture

High resistivity semiconductor-on-insulator wafer and a method of manufacturing

CHEREKDJIAN SARKO

Methods and apparatus for producing semiconductor on insulator structures using directed exfoliation

Methods and apparatus for producing semiconductor on insulator structures using directed exfoliation

CHUANG TA KO

Oxygen plasma conversion process for preparing a surface for bonding

SUNEDISON SEMICONDUCTOR LTD (UEN201334164H)

Handle substrate for use in manufacture of semiconductor-on-insulator structure and method of manufacturing thereof

MOHAMED NADIA BEN

Process of making semiconductor on glass substrates with a stiffening layer

USENKO ALEX

Diode and method of making the same