Inventor
INOKUCHI YASUHIRO
JP31 patents
⚠️ This page may combine multiple inventors who share the name “INOKUCHI YASUHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI INT ELECTRIC INC
12 patentsUS6503079B2Jan 7, 2003
Substrate processing apparatus and method for manufacturing semiconductor device
HITACHI INT ELECTRIC INC478 citations96
US7861668B2Jan 4, 2011
Batch-type remote plasma processing apparatus
HITACHI INT ELECTRIC INC19 citations92
US8028652B2Oct 4, 2011
Batch-type remote plasma processing apparatus
HITACHI INT ELECTRIC INC7 citations83
US8020514B2Sep 20, 2011
Batch-type remote plasma processing apparatus
HITACHI INT ELECTRIC INC9 citations83
US6872636B2Mar 29, 2005
Method for fabricating a semiconductor device
HITACHI INT ELECTRIC INC13 citations83
US6764916B1Jul 20, 2004
Manufacturing method for semiconductor device
HITACHI INT ELECTRIC INC14 citations82
US9039912B2May 26, 2015
Batch-type remote plasma processing apparatus
HITACHI INT ELECTRIC INC3 citations62
US6949474B2Sep 27, 2005
Method of manufacturing a semiconductor device and a semiconductor manufacture system
HITACHI INT ELECTRIC INC3 citations62
US8012885B2Sep 6, 2011
Manufacturing method of semiconductor device
HITACHI INT ELECTRIC INC1 citations52
US9373499B2Jun 21, 2016
Batch-type remote plasma processing apparatus
HITACHI INT ELECTRIC INC0 citations51
US7851379B2Dec 14, 2010
Substrate processing method and substrate processing apparatus
HITACHI INT ELECTRIC INC0 citations51
US8025739B2Sep 27, 2011
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC1 citations50
KOKUSAI ELECTRIC CO LTD
7 patentsUS6217663B1Apr 17, 2001
Substrate processing apparatus and substrate processing method
KOKUSAI ELECTRIC CO LTD69 citations94
US6332927B1Dec 25, 2001
Substrate processing apparatus
KOKUSAI ELECTRIC CO LTD20 citations92
US6139641AOct 31, 2000
Substrate processing apparatus having a gas heating tube
KOKUSAI ELECTRIC CO LTD21 citations92
US5960159ASep 28, 1999
Heat treatment of semiconductor wafers where upper heater directly heats upper wafer in its entirety and lower heater directly heats lower wafer in its entirety
KOKUSAI ELECTRIC CO LTD37 citations91
US6462411B1Oct 8, 2002
Semiconductor wafer processing apparatus for transferring a wafer mount
KOKUSAI ELECTRIC CO LTD40 citations90
US6132553AOct 17, 2000
Substrate processing apparatus
KOKUSAI ELECTRIC CO LTD17 citations83
US6270581B1Aug 7, 2001
Wet-oxidation apparatus and wet-oxidation method
KOKUSAI ELECTRIC CO LTD12 citations73
KOKUSAI ELECTRIC CORP
6 patentsUS11705325B2Jul 18, 2023
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations71
US12142476B2Nov 12, 2024
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US11527401B2Dec 13, 2022
Method of processing substate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US12266522B2Apr 1, 2025
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations60
US11915927B2Feb 27, 2024
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations60
US11361961B2Jun 14, 2022
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP1 citations60