Inventor
SINGH PRABJIT
US84 patents
⚠️ This page may combine multiple inventors who share the name “SINGH PRABJIT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
41 patentsUS7301770B2Nov 27, 2007
Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins
IBM82 citations98
US6587345B2Jul 1, 2003
Electronic device substrate assembly with impermeable barrier and method of making
IBM70 citations96
US6233959B1May 22, 2001
Dehumidified cooling assembly for IC chip modules
IBM63 citations96
US6125036ASep 26, 2000
Moisture barrier seals for cooled IC chip module assemblies
IBM77 citations96
US8806749B2Aug 19, 2014
Two-phase, water-based immersion-cooling apparatus with passive deionization
IBM33 citations94
US7133286B2Nov 7, 2006
Method and apparatus for sealing a liquid cooled electronic device
IBM41 citations93
US6192701B1Feb 27, 2001
Sealed multi-chip module cooling system
IBM20 citations93
US7816785B2Oct 19, 2010
Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
IBM45 citations92
US7673389B2Mar 9, 2010
Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component
IBM18 citations92
US7254888B2Aug 14, 2007
Method for manufacturing graphite-base heat sinks
IBM32 citations92
US6940712B2Sep 6, 2005
Electronic device substrate assembly with multilayer impermeable barrier and method of making
IBM44 citations92
US6918438B2Jul 19, 2005
Finned heat sink
IBM23 citations92
US6907917B2Jun 21, 2005
Graphite-based heat sinks and method and apparatus for the manufacture thereof
IBM22 citations92
US6794571B1Sep 21, 2004
EMC sealing system and method for an electrical enclosure
IBM24 citations92
US6246581B1Jun 12, 2001
Heated PCB interconnect for cooled IC chip modules
IBM39 citations92
US6243268B1Jun 5, 2001
Cooled IC chip modules with an insulated circuit board
IBM52 citations92
US6233960B1May 22, 2001
Spot cooling evaporator cooling system for integrated circuit chip modules
IBM30 citations92
US5167513ADec 1, 1992
Load limited pin for an electrical connector
IBM26 citations91
US7085135B2Aug 1, 2006
Thermal dissipation structure and method employing segmented heat sink surface coupling to an electronic component
IBM34 citations90
US6255832B1Jul 3, 2001
Flexible wafer level probe
IBM30 citations90
US10160072B2Dec 25, 2018
Liquid-cooled, composite heat sink assemblies
IBM14 citations84
US9890878B2Feb 13, 2018
Formed hose with different fiber-reinforced regions
IBM4 citations84
US9746109B2Aug 29, 2017
Fabricating formed hose with different fiber-reinforced regions
IBM4 citations84
US9677987B2Jun 13, 2017
Measurement of particulate matter deliquescence relative humidity
IBM7 citations84
US9568445B2Feb 14, 2017
Salt-based device and a circuit to monitor and log the times a data center air goes above a predefined limit
IBM14 citations84
US9423058B2Aug 23, 2016
Formed hose with different fiber-reinforced regions
IBM5 citations84
US9357682B2May 31, 2016
Cooling method with automated seasonal freeze protection
IBM13 citations84
US9351431B2May 24, 2016
Cooling system with automated seasonal freeze protection
IBM12 citations84
US9282675B2Mar 8, 2016
Thermal expansion-enhanced heat sink for an electronic assembly
IBM11 citations84
US7883266B2Feb 8, 2011
Method and apparatus for defect detection in a cold plate
IBM12 citations84
US7109722B2Sep 19, 2006
Apparatus and method for PCB smoke and burn detection and prevention
IBM16 citations84
US6684501B2Feb 3, 2004
Foil heat sink and a method for fabricating same
IBM15 citations84
US7837352B2Nov 23, 2010
Light source for illuminating an electronics rack to facilitate servicing thereof
IBM15 citations83
US8720063B2May 13, 2014
Thermal expansion-enhanced heat sink for an electronic assembly
IBM6 citations82
US10729016B1Jul 28, 2020
Shape-memory alloy connector for plated through-hole
IBM2 citations73
US10265812B2Apr 23, 2019
Liquid-cooled, composite heat sink assemblies
IBM4 citations73
US10241021B2Mar 26, 2019
Measurement of particulate matter deliquescence relative humidity
IBM2 citations73
US10234061B2Mar 19, 2019
Formed hose with different fiber-reinforced regions
IBM2 citations73
US9575040B2Feb 21, 2017
Methods and apparatus for detection of gaseous corrosive contaminants
IBM2 citations73
US8919388B2Dec 30, 2014
Implementing pre-treatment of water cooling hoses to increase reliability
IBM4 citations73
US8823535B2Sep 2, 2014
Early detection of environmental conditions that will lead to creep corrosion on printed circuit boards in data centers
IBM4 citations73
CAMPBELL LEVI A
4 patentsUS8867209B2Oct 21, 2014
Two-phase, water-based immersion-cooling apparatus with passive deionization
CAMPBELL LEVI A50 citations98
US8743545B2Jun 3, 2014
Thermal expansion-enhanced heat sink for an electronic assembly
CAMPBELL LEVI A15 citations93
US8387249B2Mar 5, 2013
Apparatus and method for facilitating servicing of a liquid-cooled electronics rack
CAMPBELL LEVI A33 citations93
US8857057B2Oct 14, 2014
Apparatus and method for facilitating servicing of a liquid-cooled electronics rack
CAMPBELL LEVI A9 citations84
FLORENCE JR ROBERT F
1 patentAPPLE INC
1 patentCHEY S JAY
1 patentHAMANN HENDRIK F
1 patentIYENGAR MADHUSUDAN K
1 patentShowing the top 50 of 84 patents by PatentIndex Score.