Inventor
CHA SEUNG-YONG
KR29 patents
⚠️ This page may combine multiple inventors who share the name “CHA SEUNG-YONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG KWANGJU ELECTRONICS CO
12 patentsUS7854782B2Dec 21, 2010
Vacuum cleaner
SAMSUNG KWANGJU ELECTRONICS CO57 citations98
US7794515B2Sep 14, 2010
Cyclone separating apparatus for vacuum cleaner
SAMSUNG KWANGJU ELECTRONICS CO61 citations98
US7691161B2Apr 6, 2010
Cyclone dust-collecting apparatus
SAMSUNG KWANGJU ELECTRONICS CO136 citations98
US7780752B2Aug 24, 2010
Cyclone dust-separating apparatus of vacuum cleaner
SAMSUNG KWANGJU ELECTRONICS CO49 citations94
US7749296B2Jul 6, 2010
Cyclone dust-separating apparatus of vacuum cleaner
SAMSUNG KWANGJU ELECTRONICS CO26 citations92
US7640625B2Jan 5, 2010
Vacuum cleaner
SAMSUNG KWANGJU ELECTRONICS CO44 citations92
US7637973B2Dec 29, 2009
Vacuum cleaner in which a dust bag or a cyclone dust collecting apparatus is selectively mounted
SAMSUNG KWANGJU ELECTRONICS CO41 citations92
US7611558B2Nov 3, 2009
Dust compressing apparatus of vacuum cleaner
SAMSUNG KWANGJU ELECTRONICS CO30 citations92
US7562414B2Jul 21, 2009
Dust sensing unit for use in vacuum cleaner
SAMSUNG KWANGJU ELECTRONICS CO21 citations92
US7789923B2Sep 7, 2010
Dust-collecting apparatus of a vacuum cleaner
SAMSUNG KWANGJU ELECTRONICS CO13 citations84
US7774897B2Aug 17, 2010
Vacuum cleaner having apparatus for giving off fragrant odor
SAMSUNG KWANGJU ELECTRONICS CO7 citations74
US7628846B2Dec 8, 2009
Vacuum cleaner
SAMSUNG KWANGJU ELECTRONICS CO7 citations74
SAMSUNG ELECTRONICS CO LTD
12 patentsUS11244938B2Feb 8, 2022
Electronic device package
SAMSUNG ELECTRONICS CO LTD15 citations84
US9721644B2Aug 1, 2017
Semiconductor memory device for improving signal integrity issue in center pad type of stacked chip structure
SAMSUNG ELECTRONICS CO LTD5 citations83
US10424571B2Sep 24, 2019
Electronic device package
SAMSUNG ELECTRONICS CO LTD6 citations82
US10879294B2Dec 29, 2020
Image sensor package having multi-level stack structure
SAMSUNG ELECTRONICS CO LTD3 citations72
US10541263B2Jan 21, 2020
Image sensor package having multi-level stack structure
SAMSUNG ELECTRONICS CO LTD4 citations72
US9659852B2May 23, 2017
Semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations70
US11837577B2Dec 5, 2023
System-in-package module
SAMSUNG ELECTRONICS CO LTD0 citations62
US11398454B2Jul 26, 2022
System-in-package module
SAMSUNG ELECTRONICS CO LTD0 citations62
US9830973B2Nov 28, 2017
Semiconductor memory device for improving signal integrity issue in center pad type of stacked chip structure
SAMSUNG ELECTRONICS CO LTD0 citations51
US9041222B2May 26, 2015
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations51
US8866310B2Oct 21, 2014
Semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations51
US9799591B2Oct 24, 2017
Semiconductor packages including thermal blocks
SAMSUNG ELECTRONICS CO LTD0 citations40