Inventor
TRAVIS EDWARD O
US58 patents
⚠️ This page may combine multiple inventors who share the name “TRAVIS EDWARD O”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FREESCALE SEMICONDUCTOR INC
21 patentsUS6956281B2Oct 18, 2005
Semiconductor device for reducing photovolatic current
FREESCALE SEMICONDUCTOR INC27 citations92
US7276435B1Oct 2, 2007
Die level metal density gradient for improved flip chip package reliability
FREESCALE SEMICONDUCTOR INC27 citations90
US9445050B2Sep 13, 2016
Teleconferencing environment having auditory and visual cues
FREESCALE SEMICONDUCTOR INC9 citations84
US8946000B2Feb 3, 2015
Method for forming an integrated circuit having a programmable fuse
FREESCALE SEMICONDUCTOR INC8 citations84
US7247552B2Jul 24, 2007
Integrated circuit having structural support for a flip-chip interconnect pad and method therefor
FREESCALE SEMICONDUCTOR INC12 citations83
US9515006B2Dec 6, 2016
3D device packaging using through-substrate posts
FREESCALE SEMICONDUCTOR INC5 citations73
US7322014B2Jan 22, 2008
Method of implementing polishing uniformity and modifying layout data
FREESCALE SEMICONDUCTOR INC5 citations71
US7146593B2Dec 5, 2006
Method of implementing polishing uniformity and modifying layout data
FREESCALE SEMICONDUCTOR INC10 citations71
US7622339B2Nov 24, 2009
EPI T-gate structure for CoSi2 extendibility
FREESCALE SEMICONDUCTOR INC2 citations63
US7510922B2Mar 31, 2009
Spacer T-gate structure for CoSi2 extendibility
FREESCALE SEMICONDUCTOR INC4 citations63
US7238579B2Jul 3, 2007
Semiconductor device for reducing photovolatic current
FREESCALE SEMICONDUCTOR INC2 citations63
US7386821B2Jun 10, 2008
Primitive cell method for front end physical design
FREESCALE SEMICONDUCTOR INC5 citations62
US7470624B2Dec 30, 2008
Integrated assist features for epitaxial growth bulk/SOI hybrid tiles with compensation
FREESCALE SEMICONDUCTOR INC4 citations61
US7635920B2Dec 22, 2009
Method and apparatus for indicating directionality in integrated circuit manufacturing
FREESCALE SEMICONDUCTOR INC2 citations57
US10014257B2Jul 3, 2018
Apparatus and method for placing stressors within an integrated circuit device to manage electromigration failures
FREESCALE SEMICONDUCTOR INC0 citations52
US9508701B2Nov 29, 2016
3D device packaging using through-substrate pillars
FREESCALE SEMICONDUCTOR INC1 citations52
US9508702B2Nov 29, 2016
3D device packaging using through-substrate posts
FREESCALE SEMICONDUCTOR INC1 citations52
US9245817B2Jan 26, 2016
Semiconductor device with embedded heat spreading
FREESCALE SEMICONDUCTOR INC0 citations52
US9142507B1Sep 22, 2015
Stress migration mitigation utilizing induced stress effects in metal trace of integrated circuit device
FREESCALE SEMICONDUCTOR INC1 citations52
US9122812B2Sep 1, 2015
Semiconductor device with vias on a bridge connecting two buses
FREESCALE SEMICONDUCTOR INC0 citations52
US8003539B2Aug 23, 2011
Integrated assist features for epitaxial growth
FREESCALE SEMICONDUCTOR INC1 citations51
MOTOROLA INC
11 patentsUS6611045B2Aug 26, 2003
Method of forming an integrated circuit device using dummy features and structure thereof
MOTOROLA INC80 citations96
US6396158B1May 28, 2002
Semiconductor device and a process for designing a mask
MOTOROLA INC81 citations95
US5225372AJul 6, 1993
Method of making a semiconductor device having an improved metallization structure
MOTOROLA INC69 citations94
US6764919B2Jul 20, 2004
Method for providing a dummy feature and structure thereof
MOTOROLA INC50 citations92
US6459156B1Oct 1, 2002
Semiconductor device, a process for a semiconductor device, and a process for making a masking database
MOTOROLA INC21 citations92
US6613688B1Sep 2, 2003
Semiconductor device and process for generating an etch pattern
MOTOROLA INC31 citations91
US6593226B2Jul 15, 2003
Method for adding features to a design layout and process for designing a mask
MOTOROLA INC34 citations90
US5661082AAug 26, 1997
Process for forming a semiconductor device having a bond pad
MOTOROLA INC30 citations90
US5814893ASep 29, 1998
Semiconductor device having a bond pad
MOTOROLA INC16 citations80
US6489083B1Dec 3, 2002
Selective sizing of features to compensate for resist thickness variations in semiconductor devices
MOTOROLA INC8 citations73
US6614062B2Sep 2, 2003
Semiconductor tiling structure and method of formation
MOTOROLA INC12 citations72
REBER DOUGLAS M
9 patentsUS9082824B2Jul 14, 2015
Method for forming an electrical connection between metal layers
REBER DOUGLAS M13 citations84
US8694926B2Apr 8, 2014
Techniques for checking computer-aided design layers of a device to reduce the occurrence of missing deck rules
REBER DOUGLAS M4 citations73
US8707231B2Apr 22, 2014
Method and system for derived layer checking for semiconductor device design
REBER DOUGLAS M3 citations63
US9318409B1Apr 19, 2016
Integrated circuit heater for reducing stress in the integrated circuit material and chip leads of the integrated circuit, and for optimizing performance of devices of the integrated circuit
REBER DOUGLAS M1 citations52
US9236344B2Jan 12, 2016
Thin beam deposited fuse
REBER DOUGLAS M0 citations52
US9122829B2Sep 1, 2015
Stress migration mitigation
REBER DOUGLAS M0 citations52
US8972922B2Mar 3, 2015
Method for forming an electrical connection between metal layers
REBER DOUGLAS M1 citations52
US8736071B2May 27, 2014
Semiconductor device with vias on a bridge connecting two buses
REBER DOUGLAS M0 citations52
US8640072B1Jan 28, 2014
Method for forming an electrical connection between metal layers
REBER DOUGLAS M1 citations52
SHROFF MEHUL D
6 patentsUS9455220B2Sep 27, 2016
Apparatus and method for placing stressors on interconnects within an integrated circuit device to manage electromigration failures
SHROFF MEHUL D8 citations84
US8601430B1Dec 3, 2013
Device matching tool and methods thereof
SHROFF MEHUL D13 citations84
US8595667B1Nov 26, 2013
Via placement and electronic circuit design processing method and electronic circuit design utilizing same
SHROFF MEHUL D10 citations84
US9443804B2Sep 13, 2016
Capping layer interface interruption for stress migration mitigation
SHROFF MEHUL D3 citations73
US8832624B1Sep 9, 2014
Multi-layer process-induced damage tracking and remediation
SHROFF MEHUL D4 citations73
US8856705B2Oct 7, 2014
Mismatch verification device and methods thereof
SHROFF MEHUL D1 citations51
TRAVIS EDWARD O
3 patentsUS9652577B2May 16, 2017
Integrated circuit design using pre-marked circuit element object library
TRAVIS EDWARD O3 citations71
US8796841B2Aug 5, 2014
Semiconductor device with embedded heat spreading
TRAVIS EDWARD O2 citations61
US8581390B2Nov 12, 2013
Semiconductor device with heat dissipation
TRAVIS EDWARD O1 citations51
Showing the top 50 of 58 patents by PatentIndex Score.