Inventor
HARRIS RANDY A
US18 patents
⚠️ This page may combine multiple inventors who share the name “HARRIS RANDY A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMITOOL INC
10 patentsUS7371998B2May 13, 2008
Thermal wafer processor
SEMITOOL INC20 citations92
US7371306B2May 13, 2008
Integrated tool with interchangeable wet processing components for processing microfeature workpieces
SEMITOOL INC42 citations91
US7334826B2Feb 26, 2008
End-effectors for handling microelectronic wafers
SEMITOOL INC24 citations91
US7281741B2Oct 16, 2007
End-effectors for handling microelectronic workpieces
SEMITOOL INC12 citations83
US7520286B2Apr 21, 2009
Apparatus and method for cleaning and drying a container for semiconductor workpieces
SEMITOOL INC16 citations82
US7198694B2Apr 3, 2007
Integrated tool with interchangeable wet processing components for processing microfeature workpieces and automated calibration systems
SEMITOOL INC16 citations81
US7114903B2Oct 3, 2006
Apparatuses and method for transferring and/or pre-processing microelectronic workpieces
SEMITOOL INC10 citations73
US7934898B2May 3, 2011
High throughput semiconductor wafer processing
SEMITOOL INC4 citations62
US7849865B2Dec 14, 2010
System for processing a workpiece
SEMITOOL INC6 citations62
US6969841B2Nov 29, 2005
Method and apparatus for securing microelectronic workpiece containers
SEMITOOL INC0 citations41
APPLIED MATERIALS INC
6 patentsUS10174437B2Jan 8, 2019
Wafer electroplating chuck assembly
APPLIED MATERIALS INC3 citations69
US9812344B2Nov 7, 2017
Wafer processing system with chuck assembly maintenance module
APPLIED MATERIALS INC3 citations69
US12476120B2Nov 18, 2025
Modular mainframe layout for supporting multiple semiconductor process modules or chambers
APPLIED MATERIALS INC0 citations56
US11935771B2Mar 19, 2024
Modular mainframe layout for supporting multiple semiconductor process modules or chambers
APPLIED MATERIALS INC0 citations56
US11935770B2Mar 19, 2024
Modular mainframe layout for supporting multiple semiconductor process modules or chambers
APPLIED MATERIALS INC0 citations47
US9598788B2Mar 21, 2017
Electroplating apparatus with contact ring deplating
APPLIED MATERIALS INC0 citations39